Global Package Reliability Engineer

Micron Technology; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

Micron Technology is seeking a Global Quality (GQ) Package Reliability Engineer to drive end-to-end package qualification for new products, designs, materials, or processes, and to advise on release readiness based on reliability data.

You will lead qualification plans, plan and execute reliability tests, perform 8D root cause analysis, coordinate corrective actions, and engage with customers and internal teams, applying AI-enabled insights to improve efficiency while upholding Micron's quality

Qualifications

• Bachelor's or Master’s degree in Mechanical, Electronics, or Materials Science.
• 0–1 year experience in Micro Electronic Packaging, Quality/Reliability Engineering, or Failure Analysis.

Responsibilities

• Lead and coordinate package qualification for new products and process introductions.
• Develop and implement qualification plans for new technologies and product developments.
• Provide recommendations on release readiness based on reliability outcomes.
• Develop reliability test plans to evaluate excursions, conversions, and qualification issues.
• Coordinate root cause investigations and corrective actions for qualification failures and RMAs.

Skills

SMT knowledge

Reliability testing

Problem solving

Project management

Communication skills

Backend software

Quality tools

AI-enabled improvements

Education

Bachelor/Master in Engineering

Tools

SPC

FMEA

8D

Job description

Micron Technology is seeking a Global Quality (GQ) Package Reliability Engineer to drive end-to-end package qualification for new products, designs, materials, or processes, and to advise on release readiness based on reliability data.

You will lead qualification plans, plan and execute reliability tests, perform 8D root cause analysis, coordinate corrective actions, and engage with customers and internal teams, applying AI-enabled insights to improve efficiency while upholding Micron's quality