Senior Process Engineer (Dry Etch)

Peoplebank Asia; Singapore; On-site; SGD 75,000 - 120,000; Full time

Job summary

Peoplebank Asia is seeking a Senior Process Engineer (Dry Etch) for a leading semiconductor manufacturer in Singapore. You will develop, optimize, and sustain Plasma/Dry Etch processes in a high-volume wafer fabrication environment, driving production targets, yield, and reliability.

The role requires 3+ years in semiconductor plasma/dry etch, strong SPC/DOE knowledge, and hands-on optimization, troubleshooting, and cross-functional collaboration to support new technology transfers and

Qualifications

• Bachelor's degree in engineering, physics, materials science, or related field.
• 3+ years of semiconductor plasma/dry etch process engineering experience.
• Strong knowledge of SPC, DOE, and failure analysis techniques.
• Hands-on experience with process optimization, troubleshooting, and yield improvement.

Responsibilities

• Develop, optimize, and sustain Plasma Etch / Dry Etch processes to meet targets.
• Troubleshoot process and equipment issues; perform root cause analysis and corrective actions.
• Use SPC, DOE, and data analysis to drive yield, capability, and process optimization.
• Collaborate with cross-functional teams on technology transfers and continuous improvement.

Skills

Process optimization

Troubleshooting

Yield improvement

Data analysis

Cross-functional teamwork

Education

Bachelor's degree in Engineering/Physics/Materials Science

Tools

SPC

DOE

Job description

Our client is a leading semiconductor manufacturer seeking a Senior Process Engineer (Dry Etch) to develop, optimize, and sustain etch processes in a high-volume wafer fabrication environment. This role is responsible for driving process capability, yield improvement, and equipment performance while supporting new technology development and continuous improvement initiatives.

RESPONSIBILITIES

• Develop, optimize, and sustain Plasma Etch / Dry Etch processes to achieve production, yield, quality, and reliability targets.
• Troubleshoot process and equipment issues, perform root cause analysis, and implement effective corrective actions to improve process stability.
• Utilize SPC, DOE, and data analysis techniques to drive yield improvement, process capability enhancement, and continuous process optimization.
• Collaborate with cross-functional teams to support new technology transfers, process qualifications, and continuous improvement initiatives focused on productivity, cycle time, and cost reduction.

REQUIREMENTS

• Bachelor's Degree in Engineering, Physics, Materials Science, or related discipline.
• 3+ years of semiconductor process engineering experience in Plasma Etch or Dry Etch.
• Strong knowledge of semiconductor fabrication processes, SPC, DOE, and failure analysis techniques.
• Hands-on experience with process optimization, troubleshooting, and yield improvement.

Please note: Due to the anticipated high volume of applications, only shortlisted candidates will be contacted. All information provided will be treated with strict confidentiality and used solely for recruitment purposes.