Mechanical Design Engineer (Semiconductor Tooling Design / CAD Software / Up to $6k / Joo Koon) - 8890

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 39,000 - 67,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. in Singapore invites applications for a Mechanical Design Engineer (Semiconductor Tooling Design) to design and develop semiconductor tools and mechanical systems at Fourth Lok Yang Road (Joo Koon).

You will handle 3D/2D drawings, tolerance analysis, BOM preparation, and collaborate with Electrical, Vision and Software Engineers. The role requires a Diploma or Degree in Mechanical Engineering, at least 3 years of design experience in semiconductor tooling, and

Qualifications

• Diploma or Degree in Mechanical Engineering or related technical discipline.
• Minimum 3 years of design experience in semiconductor tooling.
• Experience with High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus.
• Proficiency with CAD software is a must.

Responsibilities

• Design and development of Semiconductor Tools and mechanical systems.
• Planning, Scheduling and Costing of Tools and Mechanical Modules.
• Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
• Working closely with Electrical, Vision and Software Engineers.
• Willing to work extended hours in critical phases of project execution.

Job description

Mechanical Design Engineer (Semiconductor Tooling Design)

• 5 days,8.30am-6.15pm
• Salary: $3500- $6000
• Location:Fourth Lok Yang Road (Joo Koon)

Company background:

Specializes in Semiconductor Backend Tooling including Die Attach Tools, Wire Bond Tools & Bond Test Tools

Job Responsibilities:

• Design and development of Semiconductor Tools and mechanical systems.
• Planning, Scheduling and Costing of Tools and Mechanical Modules
• Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
• Working closely with Electrical, Vision and Software Engineers.
• Willing to work extended hours in critical phases of project execution.

Job Requirements:

• Diploma or Degree in Mechanical Engineering or related Technical disciplines.
• Minimum 3 years of design experiences in semiconductor tooling
• Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus
• Proficiency with CAD Softwareis a must.
• Experience with vision application, thermal modelling, calculation and measurement techniques would be an advantage.