[0580] Mechanical Design Engineer – Semiconductor Equipment & Tooling | Joo Koon/ 5 days/ $6k

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 39,000 - 67,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. in Singapore is seeking a Mechanical Design Engineer to drive the design and development of semiconductor tooling and mechanical systems in a high‑growth environment.

Based in Joo Koon, you will collaborate with Electrical, Vision and Software teams to deliver robust tooling solutions. Requirements include a Diploma or Degree in Mechanical Engineering and at least 3 years of experience in semiconductor tooling, with strong CAD skills.

Qualifications

• Diploma or degree in mechanical engineering or related technical discipline.
• Minimum 3 years of design experience in semiconductor tooling.
• Proficiency with CAD software is a must.

Responsibilities

• Design and development of semiconductor tools and mechanical systems.
• Plan, schedule and cost tools and mechanical modules.
• Produce 3D & 2D drawings, perform tolerance analysis, prepare BOM.

Skills

Mechanical design

3+ years experience

Team collaboration

Adaptability

Education

Diploma or Degree in Mechanical Engineering

Tools

CAD Software (SolidWorks/Creo)

Job description

• 5 days,8.30am-6.15pm
• Salary: $3500- $6000
• Location:Joo Koon

Company background:

Specializes in Semiconductor Backend Tooling including Die Attach Tools, Wire Bond Tools & Bond Test Tools

Job Responsibilities:

• Design and development of Semiconductor Tools and mechanical systems.
• Planning, Scheduling and Costing of Tools and Mechanical Modules
• Responsible for 3D & 2D drawings, tolerance analysis, BOM preparation.
• Working closely with Electrical, Vision and Software Engineers.
• Willing to work extended hours in critical phases of project execution.

Job Requirements:

• Diploma or Degree in Mechanical Engineering or related Technical disciplines.
• Minimum 3 years of design experiences in semiconductor tooling
• Experience with Design and Development of High-Speed Pick and Place Systems, Flip Chip Bonders, Die Attach Machines, and Lamination Machine is a definite plus
• Proficiency with CAD Softwareis a must.
• Experience with vision application, thermal modelling, calculation and measurement techniques would be an advantage.