Mechanical Design Engineer (Semiconductor Equipment)

Adecco Personnel Pte Ltd (Perm); Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Adecco Personnel Pte Ltd is representing a global semiconductor equipment manufacturer headquartered in the United States. This mechanical design engineer role focuses on developing mechanical design concepts and conducting feasibility studies for CES, CIP and R&D projects, while creating 3D models, assemblies, drawings and BOMs using Creo and SAP.

You will collaborate with customers, vendors and cross-functional teams, and provide hands-on engineering support in lab and manufacturing

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering or related field.
• Minimum 2 years of direct mechanical design experience.
• Experience with CAD, FEA and design for manufacturability.

Responsibilities

• Develop mechanical design concepts and conduct feasibility studies for CES, CIP and R&D projects.
• Create detailed 3D models, assemblies, drawings and BOMs; manage ECOs and specifications.
• Perform engineering analyses across wafer handling, robotics, vacuum systems and temperature control.
• Collaborate with customers, vendors and cross-functional teams; use Creo and SAP for project activities.
• Provide hands-on lab and manufacturing support including installation and testing.

Skills

Mechanical design

Problem solving

Teamwork

Communication

Project management

Education

Bachelor's or Master's in Mechanical Engineering

Tools

Creo

SAP

Job description

Our client is a global semiconductor equipment manufacturer headquartered in the United States, specializing in the design, manufacture and support of advanced wafer-processing equipment used in the fabrication of integrated circuits. Its technology portfolio includes solutions for plasma etch, dry strip, surface treatment and thermal processing, supporting leading semiconductor manufacturers worldwide.

The Job

• Develop mechanical design concepts and conduct feasibility studies for new CES, CIP and R&D projects.
• Participate in formal and informal design reviews, contributing technical insights, alternative design concepts and recommendations.
• Perform engineering analysis and develop solutions across areas including wafer handling and transfer, robotics, friction and particle control, vacuum systems, end effectors, precision mechanisms, slit valves, lift pins, indexers and wafer temperature management.
• Design and develop custom mechanical tooling, fixtures and associated processes to support the handling, assembly and disassembly of components, sub-assemblies and complete systems throughout the product lifecycle.
• Create detailed 3D models, assemblies, 2D engineering drawings and Bills of Materials, and manage Engineering Change Orders (ECOs), test specifications, functional specifications and product documentation.
• Collaborate closely with internal and external customers, vendors and cross-functional teams to align expectations and deliver project objectives.
• Utilise SAP, Pro/ENGINEER (Creo) and other engineering software to manage, document and support project activities.
• Provide hands-on engineering support in the laboratory and manufacturing environment, including installation, testing and troubleshooting of CES/CIP designs deployed on customer systems.

The Talent

Education & Experience

• Bachelor's or Master's degree in Mechanical Engineering or a related engineering discipline.
• Minimum 2 years of directly relevant mechanical design experience, or equivalent practical experience.

Technical Knowledge & Experience

• Strong knowledge of mechanical engineering design, mechanics and materials science, with the ability to apply engineering principles and analytical techniques to solve complex engineering problems.
• Knowledge of areas such as thermodynamics, heat transfer, measurement and control, stress analysis, Finite Element Analysis (FEA) and system integration.
• Experience in robotics, precision mechanisms, RF, plasma, gas delivery, vacuum systems, temperature control and/or electrostatic clamping is highly desirable.
• General knowledge of materials, components and technologies used in the semiconductor equipment industry.
• Working knowledge of vacuum technology and its application in mechanical design.
• Strong proficiency in CAD tools, particularly CREO (Pro/ENGINEER), as well as SAP.

Other Competencies

• Strong problem-solving, communication, project management and teamwork skills.
• Ability to manage engineering changes and work effectively with customers, vendors and cross-functional teams.
• Customer-oriented mindset with strong attention to product quality and engineering requirements.
• Ability to develop cost-effective designs with consideration for serviceability and manufacturability.
• Comfortable working in both theoretical/analytical and hands-on practical environments.
• Able to work effectively under pressure and manage multiple engineering priorities.