Mechanical Design Engineer (Semiconductor Equipment)

Adecco Portugal; Singapore; On-site; SGD 60,000 - 90,000; Full time

Job summary

Unknown company seeks a Mechanical Engineer to develop concepts for CES/CIP and R&D projects, performing analyses and creating detailed 3D models, drawings and BOMs. You will collaborate with customers and vendors, lead design reviews and provide hands-on support in lab and manufacturing settings.

The role requires 2+ years of direct mechanical design experience, a degree in Mechanical Engineering, and strong CAD/SAP proficiency, with a focus on manufacturability and serviceability.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering.
• Minimum 2 years of direct mechanical design experience.
• Experience with CAD tools (Creo) and SAP.

Responsibilities

• Develop mechanical design concepts and feasibility studies for CES, CIP and R&D projects.
• Participate in design reviews and provide technical insights and alternatives.
• Perform analysis and develop solutions across wafer handling, robotics, vacuum, and temperature control.
• Design tooling, fixtures and processes to support assembly and disassembly of components.
• Create 3D models, drawings and BOMs; manage ECOs and test specifications.
• Collaborate with customers, vendors and cross-functional teams to meet objectives.
• Utilize Creo and SAP to manage project activities and documentation.
• Provide hands-on engineering support in lab and manufacturing environments.

Skills

Mechanical design

Materials science

Thermodynamics & heat transfer

Project management

Teamwork

Education

Bachelor's degree in Mechanical Engineering

Master's degree in Mechanical Engineering

Tools

Creo (Pro/ENGINEER)

SAP

Job description

Our client is a global semiconductor equipment manufacturer headquartered in the United States, specializing in the design, manufacture and support of advanced wafer-processing equipment used in the fabrication of integrated circuits. Its technology portfolio includes solutions for plasma etch, dry strip, surface treatment and thermal processing, supporting leading semiconductor manufacturers worldwide.

The Job

• Develop mechanical design concepts and conduct feasibility studies for new CES, CIP and R&D projects.
• Participate in formal and informal design reviews, contributing technical insights, alternative design concepts and recommendations.
• Perform engineering analysis and develop solutions across areas including wafer handling and transfer, robotics, friction and particle control, vacuum systems, end effectors, precision mechanisms, slit valves, lift pins, indexers and wafer temperature management.
• Design and develop custom mechanical tooling, fixtures and associated processes to support the handling, assembly and disassembly of components, sub-assemblies and complete systems throughout the product lifecycle.
• Create detailed 3D models, assemblies, 2D engineering drawings and Bills of Materials, and manage Engineering Change Orders (ECOs), test specifications, functional specifications and product documentation.
• Collaborate closely with internal and external customers, vendors and cross-functional teams to align expectations and deliver project objectives.
• Utilise SAP, Pro/ENGINEER (Creo) and other engineering software to manage, document and support project activities.
• Provide hands‑on engineering support in the laboratory and manufacturing environment, including installation, testing and troubleshooting of CES/CIP designs deployed on customer systems.

The Talent

Education & Experience

• Bachelor's or Master's degree in Mechanical Engineering or a related engineering discipline.
• Minimum 2 years of directly relevant mechanical design experience, or equivalent practical experience.

Technical Knowledge & Experience

• Strong knowledge of mechanical engineering design, mechanics and materials science, with the ability to apply engineering principles and analytical techniques to solve complex engineering problems.
• Knowledge of areas such as thermodynamics, heat transfer, measurement and control, stress analysis, Finite Element Analysis (FEA) and system integration.
• Experience in robotics, precision mechanisms, RF, plasma, gas delivery, vacuum systems, temperature control and/or electrostatic clamping is highly desirable.
• General knowledge of materials, components and technologies used in the semiconductor equipment industry.
• Working knowledge of vacuum technology and its application in mechanical design.
• Strong proficiency in CAD tools, particularly CREO (Pro/ENGINEER), as well as SAP.

Other Competencies

• Strong problem‑solving, communication, project management and teamwork skills.
• Ability to manage engineering changes and work effectively with customers, vendors and cross‑functional teams.
• Customer‑oriented mindset with strong attention to product quality and engineering requirements.
• Ability to develop cost‑effective designs with consideration for serviceability and manufacturability.
• Comfortable working in both theoretical/analytical and hands‑on practical environments.
• Able to work effectively under pressure and manage multiple engineering priorities.