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HP Singapore is seeking a hands-on Mechanical/Electromechanical Engineer to lead subsystems for Large Format printers. You will collaborate with GBU R&D and partner factories to ensure designs meet specifications, quality targets and cost goals for customer shipments.
You will own sub-systems, drive DFx inputs, support NPI and CPE activities, and provide timely issue resolution with manufacturing partners. The role requires a 4–6 year manufacturing background, strong GD&T and problem-solving
Lead in Large Format Printers' mechanical/electromechanical subsystems, working closely with cross functional teams and MPAs to ensure quality and cost in shipments.
Lead in Large Format Printers' mechanical/electromechanical subsystems, working closely with cross functional teams and MPAs to ensure quality and cost in shipments.
This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.
Sustainable impact is HP’s commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision – to create technology that makes life better for everyone, everywhere.
HP is a Human Capital Partner – we commit to human capital development and adopting progressive workplace practices globally.
Engineering
Full time
No shift premium (Singapore)
25%
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