Large Format Manufacturing Development Engineer

HP

Singapore

On-site

SGD 80,000 - 110,000

Full time

32 hours ago
Be an early applicant

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Job summary

HP Singapore is seeking a hands-on Mechanical/Electromechanical Engineer to lead subsystems for Large Format printers. You will collaborate with GBU R&D and partner factories to ensure designs meet specifications, quality targets and cost goals for customer shipments.

You will own sub-systems, drive DFx inputs, support NPI and CPE activities, and provide timely issue resolution with manufacturing partners. The role requires a 4–6 year manufacturing background, strong GD&T and problem-solving

Qualifications

  • Bachelor’s degree in Mechanical Engineering or related field.
  • 4–6 years of experience in a manufacturing environment.
  • Hands-on manufacturing experience and strong problem solving.

Responsibilities

  • Collaborate with GBU R&D and partner factory teams to deliver Large Format printer products for customer shipment.
  • Own and drive printer product sub-systems, ensuring product and process engineering performance meets specifications and functional requirements.
  • Provide swift and responsive support to factory build issues and escalations related to product performance in owned sub-systems.
  • Support NPI and CPE activities to meet program and business needs.
  • Participate in product prototyping builds locally or at GBU sites, providing DFx input and enabling knowledge transfer.
  • Drive and implement change management at manufacturing partner factories to meet engineering requirements.
  • Work with GBU and support partners to resolve product/process engineering issues in a timely manner.

Skills

Problem solving
Communication
Teamwork
GD&T fundamentals
Electro-mechanical skills
Learning agility

Education

Bachelor’s degree in Mechanical Engineering

Job description

Description -

Lead in Large Format Printers' mechanical/electromechanical subsystems, working closely with cross functional teams and MPAs to ensure quality and cost in shipments.

Description -

Lead in Large Format Printers' mechanical/electromechanical subsystems, working closely with cross functional teams and MPAs to ensure quality and cost in shipments.

Responsibilities Include
  • Collaborate with GBU R&D and manufacturing partner factory teams to deliver Large Format printer products for customer shipment.
  • Own and drive printer product sub-systems , ensuring product and process engineering performance meets specifications and functional requirements.
  • Provide swift and responsive support to factory build issues and escalations related to product performance in owned sub-systems.
  • Support NPI and CPE activities to meet program and business needs.
  • Participate in product prototyping builds locally or at GBU sites, providing DFx input and enabling effective product/process knowledge transfer.
  • Drive and implement change management at manufacturing partner factories to meet product/process engineering requirements.
  • Work closely with GBU and support partners to resolve product/process engineering issues in a timely manner.
  • Respond to post-MR field escalations and customer feedback to ensure satisfaction and continuous improvement.
  • Partner with Operations to drive improvements in cost, quality, and factory productivity.
  • Manage manufacturing partner to deliver to factory performance metrics & goals consistently.
Individuals who do well in this role at HP, usually possess:
  • Bachelor’s degree in Mechanical Engineering, Mechatronic Engineering or any related field or demonstrated competence.
  • 4–6 years of experience in manufacturing environment.
  • Experience in manufacturing environment with hands on approach.
  • Excellent problem-solving skills and attention to detail.
  • Strong sense of urgency according to program schedule.
  • Effective communication and teamwork skills.
  • Strong GD&T fundamentals/mechanical skills.
  • Good to have electrical and electronic skills.
  • Results Oriented.
  • Learning Agility.
  • Digital Fluency including AI Skills.
  • Customer Centricity.
Disclaimer

This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties, skills, responsibilities, knowledge, etc. These may be subject to change and additional functions may be assigned as needed by management.

Sustainable impact is HP’s commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision – to create technology that makes life better for everyone, everywhere.

HP is a Human Capital Partner – we commit to human capital development and adopting progressive workplace practices globally.

Job -

Engineering

Schedule -

Full time

Shift -

No shift premium (Singapore)

Travel -

25%

Equal Opportunity Employer (EEO) -

HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal”

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Mechanical Hardware Engineer
Mechanical Hardware Engineer

Hewlett Packard Enterprise • Singapore

On-site
SGD 120,000 - 180,000
Manufacturing Development Engineer
Manufacturing Development Engineer

National Additive Manufacturing - Innovation Cluster • Singapore

On-site
SGD 60,000 - 90,000
Program Engineer
Program Engineer

HP • Singapore

On-site
SGD 78,000 - 123,000
Device Software Product Director
Device Software Product Director

HP Inc. • Singapore

On-site
SGD 250,000 - 420,000
System Interaction Engineer (2 Years Contract, Renewable)
System Interaction Engineer (2 Years Contract, Renewable)

HP • Singapore

On-site
SGD 60,000 - 80,000
Ink Process Engineer
Ink Process Engineer

HP • Singapore

On-site
SGD 70,000 - 120,000
Supply Chain Ops / Procurement Specialist
Supply Chain Ops / Procurement Specialist

HP • Singapore

On-site
SGD 70,000 - 110,000
Device Software Product Director
Device Software Product Director

HP • Singapore

On-site
SGD 180,000 - 260,000
Graphics Supplies Product Engineer
Graphics Supplies Product Engineer

HP • Singapore

On-site
SGD 70,000 - 90,000
Software Development Engineer, LaserJet R&D
Software Development Engineer, LaserJet R&D

HP • Singapore

On-site
SGD 90,000 - 140,000