Integration Engineer: CMOS Yield & Tapeout Lead

Systems on Silicon Manufacturing Co Pte Ltd; Singapore; On-site; SGD 45,000 - 65,000; Full time

Job summary

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.) invites an Engineer to join the Integration team to manage module process integration and related derivatives in a cutting-edge semiconductor environment.

You will lead technology transfer, own tapeout prototype lots, drive robustness and quality metrics, and collaborate with product and customer engineering to resolve issues and ensure 100% wafer acceptance success.

Qualifications

• Degree in Electrical/Electronics Engineering or equivalent.
• At least 1-3 years of relevant PI/Yield Engineering working experience in semiconductor manufacturing environment.
• Technical skills and knowledge in various process modules and semiconductor devices.

Responsibilities

• Lead integration of all module processes and derivatives.
• Develop, transfer and maintain CMOS fabrication technology with good process capability and high yield.
• Own new tapeout prototype lots and ensure 100% success rate.
• Drive process robustness improvement with root cause analysis and improvement actions to meet WAT Cpk goals.
• Drive process excursion control and achieve YIELD targets (SWLY/SLLY).
• Collaborate with product engineering on yield-related tuning to meet baseline D0 targets.
• Work with Customer Engineering to resolve customer concerns and provide required information.
• Adhere to FAB change management, safety & ISMS procedures.

Skills

8D problem solving

Communication skills

Presentation skills

Automotive Quality Mindset

Stop & Fix Mindset

Root cause analysis

Education

Bachelor's degree in Electrical/Electronics Engineering or equivalent

Tools

JMP

Microsoft Office

Statistical analysis tools

Job description

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.) invites an Engineer to join the Integration team to manage module process integration and related derivatives in a cutting-edge semiconductor environment.

You will lead technology transfer, own tapeout prototype lots, drive robustness and quality metrics, and collaborate with product and customer engineering to resolve issues and ensure 100% wafer acceptance success.