Innovative Global Package Reliability Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

Micron Technology, Inc. aims to attract a Global Quality Package Reliability Engineer to ensure the quality and reliability of semiconductor packages across product lines.

You will own end-to-end package qualification for new products and new designs, assess reliability results, and guide release decisions. You will lead qualification plans, plan and execute reliability tests, perform 8D root-cause analyses, and collaborate with internal teams and external customers.

Qualifications

• Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science).
• 0–1 year experience in micro electronic packaging or reliability testing.
• Knowledge of semiconductor packaging and SMT processes; materials interactions; statistical methods.

Responsibilities

• Lead package qualification for new products and process introductions.
• Develop qualification plans for new technologies and products.
• Coordinate 8D problem solving and root cause investigations.
• Serve as technical liaison with internal teams and external customers, applying AI-enhanced quality improvements.

Skills

Semiconductor packaging

Thermo-mechanical reliability

Reliability testing methods

Data analysis skills

English communication

SMT knowledge

Quality tools

Cross-functional teamwork

Education

Bachelor’s or Master’s in Engineering (Mechanical, Electronics, Materials Science)

Job description

Micron Technology, Inc. aims to attract a Global Quality Package Reliability Engineer to ensure the quality and reliability of semiconductor packages across product lines.

You will own end-to-end package qualification for new products and new designs, assess reliability results, and guide release decisions. You will lead qualification plans, plan and execute reliability tests, perform 8D root-cause analyses, and collaborate with internal teams and external customers.