Director of Chip-to-Package Reliability & Quality

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD; Singapore; On-site; SGD 300,000 - 420,000; Full time

Job summary

Micron Technology, Inc. Singapore is seeking a Director of Package Quality & Reliability Engineering to lead the execution and continuous improvement of package reliability, qualification, and failure analysis across NPI and high-volume manufacturing.

The role collaborates with PDE, front-end fabrication, manufacturing and quality teams to drive robust Design for Reliability and structured problem-solving at the chip-to-package interface.

Qualifications

• Bachelor’s degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, or related field (Master’s or Ph.D. preferred)
• 12+ years of experience in semiconductor packaging, reliability, or manufacturing
• 5+ years of experience in people management or technical leadership roles
• Experience in high-volume manufacturing environments with exposure to package quality and reliability
• Strong understanding of semiconductor packaging technologies and materials; reliability test methodologies and applicable standards (JEDEC, AEC-Q)
• Experience with failure analysis techniques (cross-sectioning, X-ray, SEM/EDX) and root cause analysis
• Knowledge of chip-to-package interaction, thermo-mechanical stress, and reliability failure mechanisms
• Leadership and collaboration across cross-functional teams

Responsibilities

• Lead execution of package reliability qualification for NPI and high-volume manufacturing
• Identify and resolve key reliability risks including CPI, interconnect reliability, thermo-mechanical stress
• Drive improvements in reliability test coverage and methodologies for automotive, mobile, data center applications
• Ensure robust qualification processes, test plans, and reliability sign-off readiness
• Partner with PDE to integrate Design for Reliability (DFR) and Design for Manufacturability (DFM) into package design
• Collaborate with front-end fab teams to address integration challenges between silicon and packaging interfaces
• Lead or support failure analysis and RCA using structured methodologies (e.g., 8D)
• Develop team capabilities and establish KPIs and execution discipline
• Provide escalation support on critical reliability and quality issues impacting production or customers
• Engage with suppliers on package reliability and materials performance
• Leverage AI-enabled tools and data analytics to improve reliability insights and decision-making

Skills

Semiconductor packaging

Reliability testing

Failure analysis

Leadership

Cross-functional collaboration

Education

Bachelor’s degree in Materials/Mechanical/Electrical/Chemical engineering

Master’s or Ph.D. preferred

Tools

JEDEC standards

AEC-Q

Cross-sectioning

X-ray

SEM/EDX

Job description

Micron Technology, Inc. Singapore is seeking a Director of Package Quality & Reliability Engineering to lead the execution and continuous improvement of package reliability, qualification, and failure analysis across NPI and high-volume manufacturing.

The role collaborates with PDE, front-end fabrication, manufacturing and quality teams to drive robust Design for Reliability and structured problem-solving at the chip-to-package interface.