5 days Application Engineer up to $6000 (Woodlands)

TALENT RECRUITMENT PTE. LTD.; Singapore; On-site; SGD 45,000 - 67,000; Full time

Job summary

TALENT RECRUITMENT PTE. LTD. is seeking an Application Engineer in Woodlands, Singapore to develop and optimize die bonding processes and support customers on-site.

You will set up, calibrate and troubleshoot production equipment and work with cross-functional teams to resolve technical issues. The role requires hands-on experience with semiconductor equipment, die bonding, wafer handling and robust problem-solving skills.

Qualifications

• Diploma or degree in mechanical/mechatronics/electrical/electronics/materials/manufacturing/automation or related field.
• Minimum 2 years of relevant experience in semiconductor equipment, automation or precision manufacturing.
• Hands-on experience with die bonding/die attach, wafer handling and related equipment.

Responsibilities

• Develop, optimize and qualify die bonding processes and equipment.
• Set up, calibrate and troubleshoot machines; adjust process parameters and recipes.
• Conduct root cause analysis and implement corrective actions for equipment/process issues.
• Support process improvement, yield enhancement and cycle-time optimization.
• Collaborate with R&D, Engineering, Manufacturing and Quality teams on technical issues.
• Provide installation, application and technical support at customer sites.
• Conduct customer training and support Field Application Engineers.
• Gather customer feedback and support product/process improvement.

Skills

Die bonding

Die attach

Automation

Precision manufacturing

Data analysis

DOE/ SPC / Cp/Cpk / GR&R

RCA / root-cause analysis

Troubleshooting

Travel readiness

Education

Diploma or Degree in Mechanical, Mechatronics, Electrical/Electronics, Materials, Manufacturing, Automation or related Engineering

Tools

Vision systems

Servo systems

Sensors

Vacuum

Pneumatics

Precision positioning systems

Job description

Application Engineer

$4,000 – $6,000

9am – 6pm (Mon to Fri)

Woodlands

Job Responsibilities

• Develop, optimize and qualify die bonding processes and equipment.
• Set up, calibrate and troubleshoot machines; adjust process parameters and recipes.
• Conduct root cause analysis and implement corrective actions for equipment/process issues.
• Support process improvement, yield enhancement and cycle-time optimization.
• Collaborate with R&D, Engineering, Manufacturing and Quality teams on technical issues.
• Provide installation, application and technical support at customer sites.
• Conduct customer training and support Field Application Engineers.
• Gather customer feedback and support product/process improvement.

Requirements

• Diploma or Degree in Mechanical, Mechatronics, Electrical/Electronics, Materials, Manufacturing, Automation or related Engineering disciplines.
• Minimum 2 years of relevant experience in semiconductor equipment, automation, advanced packaging or precision manufacturing.
• Experience in die bonding/die attach, flip-chip, wire bonding, SMT, wafer handling, semiconductor automation or precision robotics.
• Hands-on experience in machine setup, calibration, troubleshooting and parameter adjustment.
• Knowledge of precision motion systems, servo systems, sensors, vacuum, pneumatics and tooling.
• Experience with vision/alignment or precision positioning systems is an advantage.
• Familiar with process engineering and data analysis, including DOE, SPC, Cp/Cpk, GR&R or process qualification.
• Knowledge of RCA and problem-solving tools such as 5-Why, Fishbone, 8D, DOE or FMEA.
• Willing to travel to customer sites when required.