Failure Analysis Engineer for Advanced Semiconductors

Advanced Micro Devices (S) Pte Ltd; Singapore; Vor Ort; SGD 90.000 - 130.000; Vollzeit

Benefits dieser Stelle

Night shift allowance

Zusammenfassung

AMD Singapore invites engineers to join a team performing failure analysis on advanced microprocessors and graphics processors using 3nm FINFET and below technologies. You will conduct transistor nano-probing, electrical characterization, and materials analysis to drive yield and reliability improvements.

The role covers high-precision sample prep for SoIC, site-specific TEM lamellae, plasma FIB prep, and collaboration with cross-functional groups.

Qualifikationen

• Fundamental understanding of device physics.
• Strong background in semiconductor wafer processing and materials characterization.
• Ability to perform basic tool troubleshooting and interact with vendors.
• Experience in fabless semiconductor and wafer fabs preferred.
• Mentored or managed junior engineers preferred.

Aufgaben

• Failure analysis of advanced microprocessors and graphics processors using 3nm FINFET and below tech.
• Transistor nano-probing and electrical characterization using AFM, Electron Microscopy and materials analysis.
• Advanced sample prep for SoIC, including planar, cross-sectional, site-specific prep.
• Prepare site-specific TEM lamellae using focused ion beam techniques for characterization.
• Plasma FIB prep and yield failure analysis on advanced products; cross-sectioning and preparation.
• Follow safety, EHS, procedures; handle high-energy beams and chemicals, especially night shifts.
• Support continuous improvement to increase sample-prep success rate, throughput, and tool utilization.

Jobbeschreibung

AMD Singapore invites engineers to join a team performing failure analysis on advanced microprocessors and graphics processors using 3nm FINFET and below technologies. You will conduct transistor nano-probing, electrical characterization, and materials analysis to drive yield and reliability improvements.

The role covers high-precision sample prep for SoIC, site-specific TEM lamellae, plasma FIB prep, and collaboration with cross-functional groups.