Technician, Product Development Engineering

1100 Micron SemiAsiaOP Pte Ltd

Singapore

On-site

SGD 44,640 - 78,120

Full time

14 days+

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Job summary

1100 Micron SemiAsiaOP Pte Ltd is seeking personnel to support NPI product/process transfers to the HVM site in Singapore. You will assist engineers in qualifying new packages, executing NPI and engineering samples, and improving assembly processes and materials.

The role emphasises data‑driven decision making, teamwork, and the willingness to work day and night shifts while adopting AI‑enabled manufacturing tools and digital platforms.

Qualifications

  • Diploma in Mechanical or Materials Engineering is preferred.
  • Experience in backend engineering process or package development is preferred.
  • Strong observation, execution and teamwork abilities.
  • Able to make basic data‑driven decisions and prioritize tasks.
  • Interest in semiconductor engineering and related processes.
  • Willingness to work day and night shifts and to learn AI tools.

Responsibilities

  • Support smooth transfer of new products and packages from Tech/Subcon to HVM site.
  • Assist engineer to complete qualification of NPI products/packages per timeline.
  • Assist in NPI sample builds and engineering sample builds for new products.
  • Support evaluating and improving assembly processes, materials, or equipment.
  • Identify, investigate, and document quality deviations.
  • Use troubleshooting to prevent recurrence and guide corrective actions.
  • Troubleshoot process problems and determine best course of action.
  • Support development/improvement of processes, equipment, or materials.
  • Assist in experiments (DOE) and implementing changes.
  • Assist in maintaining operation procedures and specifications.
  • Maintain knowledge of material attributes and storage requirements.
  • Evaluate/qualify new devices/equipment/material and support qualification builds.
  • Support new equipment/material qualification builds and training needs.

Skills

Backend engineering
Package development
Attention to detail
Data‑driven decisions
Semiconductor engineering
AI‑enabled manufacturing tools

Education

Diploma in Mechanical / Materials Engineering

Job description

Responsibilities
  • Support smooth transfer of new products and packages from Technology/Subcon to HVM site.
  • Assist engineer to complete qualification of NPI products / packages builds proliferating from pilot products and packages according to planned timeline.
  • Assist engineer to execute NPI Customer samples and Engineering Samples build for new products and packages according to planned timeline.
  • Support evaluating and improving assigned assembly processes, materials, and/or equipment.
  • Identify, investigate, and document quality deviations.
  • Use systematic troubleshooting techniques to troubleshoot deviations and ensure corrective action prevents reoccurrence.
  • Troubleshoot process problems and determine best course of action.
  • Support development/improvement of process, equipment, and/or material.
  • Assist engineer in conducting experiments (DOE).
  • Assist in implementation of new process and process changes to operation.
  • Assist engineer in maintaining operation procedures/specification.
  • Maintain knowledge of material attributes (shelf life, storage requirements, etc).
  • Evaluate/qualify new device, equipment and/or material; support new device FUT, qualification builds.
  • Support new equipment evaluation and qualification builds.
  • Support new material (direct or indirect) evaluation and qualification builds.
  • Coordinate training requirements and conduct training.
  • Assist engineers in developing or coordinating development of training materials for existing/new process.
Qualifications
  • Diploma in Mechanical / Materials Engineering preferred.
  • Experience in backend engineering process or package development preferred.
  • Excellent observation, execution and collaboration with team members.
  • Ability to make basic sound data‑driven decisions; prioritize and apply due‑diligence in day‑to‑day tasks.
  • Keen interest in semiconductor engineering.
  • Willingness to run day / night shift.
  • Willingness to learn and adopt AI‑enabled manufacturing tools and digital platforms.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

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