Engineer, Process (Backend)

Silicon Box Inc; Singapore; On-site; SGD 60,000 - 98,000; Full time

Job summary

Silicon Box Inc is seeking a Process Engineer to develop and establish production processes for backend semiconductor operations. The role focuses on backend lines including Pick and Place, SMT/SMD, Ball Drop, Reflow, Laser Marking, Tape and Reel, Singulation, Packing and AOI, ensuring quality and safety documentation is up to date.

The ideal candidate holds a bachelor’s degree in a relevant engineering field and has at least 3 years in semiconductor manufacturing with cleanroom exposure.

Qualifications

• Bachelor's degree in material science, microelectronics, mechanical engineering or relevant field.
• At least 3 years of experience in semiconductor manufacturing in a cleanroom.
• Hands-on backend process experience in Backend Process: Pick and Place / SMT/SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI within semiconductor IC packaging.

Responsibilities

• Responsible for Backend process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc.
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive SPC control.
• Review and maintain FMEA, Control plan, OCAP with cross-functional teams.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line
• Any other ad-hoc duties as assigned by supervisor

Skills

Backend process knowledge

Semiconductor manufacturing

Cleanroom experience

Process improvement

Education

Bachelor's degree in material science, microelectronics, mechanical engineering or relevant field

Job description

The Process Engineer is responsible for development and establishment of production process.

Responsibilities

• Responsible for Backend process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc.
• Establish, review and update specifications, workflow, quality and safety related documentation for production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive SPC control.
• Review and maintain FMEA, Control plan, OCAP with cross-functional teams.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Review and accept machine buyoff, setup pilot line process and transfer from pilot line to production line
• Any other ad-hoc duties as assigned by supervisor

Requirement

• Minimum bachelor's degree in material science, microelectronics, mechanical engineering or relevant engineering field
• At least 3 years of experience in semiconductor manufacturing industry and working in cleanroom environment
• Hands-on process experience in Backend Process: Pick and Place / SMT and SMD / Ball Drop / Reflow / Laser Marking / Tape and Reel / Singulation / Packing / AOI, etc withinsemiconductor IC packaging industry
• Experience in SPC, DPE, FMEA, OCAP, WI, CPK, PPK, 4D/8D report