Engineer, Process (Die Prep)

SILICON BOX PTE. LTD.; Singapore; On-site; SGD 61,000 - 95,000; Full time

Job summary

SILICON BOX PTE. LTD. in Singapore seeks a Process Engineer (Die Prep) to establish and optimize production processes for Die Prep (Backgrind, Dicing, Laser Grooving).

You will review specifications, drive SPC control, manage FMEA and 8D reports, support NPI activities and customer audits, and coordinate with vendors to resolve process and quality issues.

Minimum degree in engineering and 3 years hands-on Die Prep experience in semiconductor/manufacturing is required.

Qualifications

• Minimum Degree in Electrical & Electronics, Microelectronics, Mechanical engineering or relevant engineering discipline
• Experience in Semiconductor manufacturing industry and working in cleanroom environment
• Minimum 3 years hands-on Die Prep process such as Backgrind, Dicing, Laser Grooving within semiconductor / electronics manufacturing industry
• Experience in SPC, DOE, FEMA, and 8D reports

Responsibilities

• Establish, review and update specifications, workflow, quality and safety related documentation for Die Prep processes within production line.
• Troubleshoot process issue and improve process capabilities, yield and cycle time from customer NPI stage to LVM/HVM stage.
• Process sustaining and control through SPC and periodic defect Pareto Analysis.
• Lead and drive SPC control
• Review and maintain FMEA, Control plan, OCAP with cross-functional teams.
• Handle and manage customer audits and 8D reports.
• Provide disposition for engineering and production lots.
• Conduct process characterization and qualification to establish process baseline.
• Coordinate and liaise with vendor/suppliers on process issue or quality issue.
• Support customer NPI activities and internal engineering activities.
• New material, process & machine development and qualification.
• Review and accept machine buyoff, setup pilot line process and transfer from pilot to production line

Skills

SPC

DOE

FMEA

8D

Education

Bachelor's degree in Electrical & Electronics, Microelectronics, Mechanical engineering or relevant engineering discipline

Tools

Backgrind

Dicing

Laser Grooving

Job description

Position Summary

The Process Engineer(Die Prep)is responsible fordevelopment and establishment of production process.

Responsibilities

• Establish, review and update specifications, workflow,qualityand safety related documentation forDie Prep (Backgrind, Dicing, Laser Grooving, etc)processeswithinproduction line.

• Troubleshoot process issue and improve process capabilities,yieldand cycle time from customer NPI stage to LVM/HVM stage.

• Process sustaining and control through SPC and periodic defect Pareto Analysis.

• Lead and drive SPC control

• Review andmaintainFMEA, Control plan,OCAP with cross-functional teams.

• Handle and manage customer audits and 8D reports.

• Provide disposition for engineering and production lots.

• Conduct process characterization and qualification toestablishprocess baseline.

• Coordinate and liaise with vendor/suppliers on process issue or quality issue.

• Support customer NPI activities and internal engineering activities.

• New material, process & machinedevelopmentand qualification.

• Review and accept machine buyoff, setup pilot line process and transfer from pilot to production line
  

Requirements

• Minimum Degree in Electrical & Electronics, Microelectronics, Mechanicalengineeringor relevant engineering discipline

• Experience in Semiconductor manufacturing industryandworking in cleanroom environment

• Minimum 3 years hands-onDie Prep process such asBackgrind, Dicing, Laser Groovingwithin semiconductor / electronics manufacturing industry

• Experience in SPC, DOE, FEMA, and 8D reports