Electroplating Process Engineering Lead

Applied Materials; Singapore; Presencial; SGD 180.000 - 260.000; Jornada completa

Descripción de la vacante

Applied Materials is seeking a Manager, Process Engineering (Electroplating) in Singapore to lead development and optimization of next-gen electroplating processes for advanced semiconductor packaging. You will manage engineers, drive process innovation, support customer engagements, and collaborate with global teams to deliver differentiated products.

The role requires 8+ years in semiconductor process engineering with hands-on plating expertise, strong knowledge of copper plating and packaging

Formación

• Bachelor’s, Master’s or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field.
• 8+ years of semiconductor process engineering experience, including hands-on electroplating/electrochemical deposition.
• Strong knowledge of copper plating, wafer-level packaging, RDL, copper pillars, TSVs, and advanced packaging.
• Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
• Demonstrated people leadership experience, with the ability to develop and mentor engineering teams.
• Expertise in process characterization, DOE, statistical analysis, troubleshooting, and root cause analysis.
• Strong understanding of plating chemistry, deposition uniformity, defect reduction, and process optimization.
• Experience collaborating with customers and cross-functional teams to resolve complex technical challenges.
• Excellent communication skills with the ability to prepare technical reports, specifications, and executive presentations.

Responsabilidades

• Manage engineers in utilizing techniques to characterize hardware, define methods and new technologies.
• Manage, develop, plan and execute process engineering projects for entire range of products.
• Interact with key customers to resolve significantly complex process engineering issues.
• Develop and implement new technology, products and analytical instrumentation.
• Train, define and implement new methodologies, apply new technologies, troubleshoot, and resolve complex issues.
• Generate internal and external documentation for products and specifications.
• Contributes to market share gains through technology improvement.

Conocimientos

Electroplating

Copper plating

Wafer-level packaging

RDL

TSVs

Team leadership

DOE

Statistical analysis

Root cause analysis

Process optimization

Cross-functional collaboration

Technical communication

Educación

Bachelor’s/Master’s/PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or related field

Descripción del empleo

Applied Materials is seeking a Manager, Process Engineering (Electroplating) in Singapore to lead development and optimization of next-gen electroplating processes for advanced semiconductor packaging. You will manage engineers, drive process innovation, support customer engagements, and collaborate with global teams to deliver differentiated products.

The role requires 8+ years in semiconductor process engineering with hands-on plating expertise, strong knowledge of copper plating and packaging