CMOS Process Integration Engineer: Tapeout & Yield

SYSTEMS ON SILICON MANUFACTURING COMPANY PTE LTD; Singapore; On-site; SGD 55,000 - 80,000; Full time

Job summary

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.) is seeking an Engineer to join the Integration team.

You will manage the integration of all module processes and derivatives within a leading CMOS fabrication environment, driving new technology transfer and process improvements. The role requires 1–3 years in PI/Yield Engineering in semiconductor manufacturing, strong 8D problem solving, SPC knowledge, and proficiency with JMP and Microsoft Office.

Qualifications

• Degree in Electrical/Electronics Engineering or equivalent.
• 1–3 years of PI/Yield Engineering in semiconductor manufacturing.
• Knowledge of process modules and semiconductor devices.
• Automotive Quality Mindset and Stop & Fix Mindset.
• Strong 8D problem solving, presentation and communication skills.
• Failure analysis and SPC knowledge.
• Proficient in Microsoft applications; JMP knowledge is a plus.

Responsibilities

• Lead the integration of all module processes and derivatives.
• Develop, transfer and maintain CMOS fabrication technology with high yield.
• Own new tapeout prototype lots and ensure 100% WAT success.
• Drive robustness and process excursions with root cause analysis.
• Collaborate on product sensitivity and process tuning to meet targets.
• Resolve customer issues with engineering teams and provide required info.

Skills

PI/Yield Engineering

8D problem solving

SPC knowledge

Microsoft Office

Root cause analysis

Education

Bachelor's degree in Electrical/Electronics Engineering

Tools

JMP

Excel

Job description

SSMC (Systems on Silicon Manufacturing Company Pte. Ltd.) is seeking an Engineer to join the Integration team.

You will manage the integration of all module processes and derivatives within a leading CMOS fabrication environment, driving new technology transfer and process improvements. The role requires 1–3 years in PI/Yield Engineering in semiconductor manufacturing, strong 8D problem solving, SPC knowledge, and proficiency with JMP and Microsoft Office.