Chip Development Program Manager - Front-End

Achieve Group; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Achieve Group is seeking an experienced Program Manager to own end-to-end coordination of chip development projects. You will drive programs from definition through tape-out, qualification, and ramp to mass production, partnering with IC design, MEMS, packaging and test teams as well as foundry partners.

Strong cross-functional collaboration and excellent communication are essential. The role requires leadership across global sites, proactive risk management, and clear reporting to senior

Qualifications

• 5+ years of project/program management experience in semiconductor, IC, or chip development environments.
• Solid working knowledge of the chip development lifecycle (design, tape-out, fab, packaging, test, mass production).
• Strong cross-functional coordination skills, with experience managing multiple stakeholders across engineering and business functions.

Responsibilities

• Own end-to-end program management for one or more chip development projects across IC design, MEMS, packaging and test.
• Drive programs from definition through tape-out, qualification, and mass production ramp.
• Build and manage detailed program schedules, milestones, and critical path tracking.
• Coordinate cross-functionally with design, MEMS/product engineering, packaging & test, and quality teams across global sites.
• Manage foundry and external partner relationships and timelines where applicable.
• Identify, elevate, and drive resolution of program risks, blockers, and schedule slippage.
• Report program status, risks, and key decisions to senior leadership and business unit stakeholders.

Skills

Project management

Cross-functional coordination

Organizational skills

Communication skills

Stakeholder management

Job description

Achieve Group is seeking an experienced Program Manager to own end-to-end coordination of chip development projects. You will drive programs from definition through tape-out, qualification, and ramp to mass production, partnering with IC design, MEMS, packaging and test teams as well as foundry partners.

Strong cross-functional collaboration and excellent communication are essential. The role requires leadership across global sites, proactive risk management, and clear reporting to senior