Backgrind & Dicing Process Engineer

ADVANCED MICRO FOUNDRY PTE. LTD.; Singapore; In loco; SGD 40.000 - 70.000; Tempo pieno

Descrizione del lavoro

GlobalFoundries seeks an Associate Engineer – Backgrind & Dicing to support wafer manufacturing by operating and improving backgrind and dicing processes. You will set up equipment, monitor controls, and drive defect reduction while coordinating with cross-functional teams to ensure safety and quality compliance.

The role emphasizes hands-on experience in assembly/backgrind/dicing with responsibilities spanning inspections, data entry in SiView, and routine PMs.

Competenze

• Diploma or ITE Hi-Nitec in Electrical, Electronic or Mechanical.
• Minimum 2 years in electronics production, OSAT/assembly background preferred.
• Able to work 12-hour rotating shifts and perform process checks.

Mansioni

• Support daily backgrind and dicing operations.
• Perform inspections for incoming/outgoing materials and enter data accurately.
• Carrying out laminating, taping/detaping, backgrind and dicing per process requirements.
• Measure thickness and input data into the SiView system.
• Run equipment PMs and log SPC data for critical parameters.
• Collaborate with process/engineering teams to resolve issues.

Conoscenze

SPC knowledge

MS Office literacy

Formazione

Diploma / ITE Hi-Nitec (Electrical/Electronic/Mechanical)

Strumenti

MS Office

Descrizione del lavoro

GlobalFoundries seeks an Associate Engineer – Backgrind & Dicing to support wafer manufacturing by operating and improving backgrind and dicing processes. You will set up equipment, monitor controls, and drive defect reduction while coordinating with cross-functional teams to ensure safety and quality compliance.

The role emphasizes hands-on experience in assembly/backgrind/dicing with responsibilities spanning inspections, data entry in SiView, and routine PMs.