Advanced Packaging Engineering Intern: RDL & Hybrid Bonding

Applied Materials, Inc.; Singapore; On-site; SGD 13,000 - 20,000; Full time

Job summary

Applied Materials, Inc. in Singapore is offering an internship focused on advanced packaging and process integration.

You will join the Process Integration team to develop and characterize test vehicles for chip-to-wafer and wafer-to-wafer bonding, gaining hands-on experience in semiconductor fabrication. The program includes data analysis, defect characterization, experimental design, and understanding how processing parameters affect electrical and physical performance, with opportunities to

Qualifications

• Internship in advanced packaging technologies.

Responsibilities

• Develop process flows for chip-to-wafer and wafer-to-wafer bonding;
• Design experiments and analyze data to characterize defects.
• Correlate process parameters to electrical and physical performance metrics.
• Gain hands-on exposure to semiconductor fabrication processes and packaging integration.

Job description

Applied Materials, Inc. in Singapore is offering an internship focused on advanced packaging and process integration.

You will join the Process Integration team to develop and characterize test vehicles for chip-to-wafer and wafer-to-wafer bonding, gaining hands-on experience in semiconductor fabrication. The program includes data analysis, defect characterization, experimental design, and understanding how processing parameters affect electrical and physical performance, with opportunities to