Cu-Pillar Underfill R&D Internship in Materials Eng

Bosch; Braga; Presencial; EUR 30 000 - 46 000; Tempo integral

Vantagens oferecidas por esta oferta de emprego

Exchange with colleagues worldwide

On-site medical office & social office

Training opportunities

Continuous professional development

Discounts with partners

Sports and health activities

Excellent public transport access

Free transport from Porto

Free parking

Canteen

Resumo da oferta

Bosch Car Multimedia, S.A. invites applications for a position focusing on the investigation of Cu-pillar underfill for semiconductor applications.

The role involves literature review, material property analysis, and comprehensive material characterization in collaboration with Bosch BrgP and University of Minho. The project will be conducted in Bosch BrgP labs and production environments, with testing at the University of Minho, including DMA and TMA, requiring strong communication in English

Qualificações

• Knowledge in materials characterization techniques, chemical analysis and material science.
• Knowledge in testing and statistical methods.
• Prefered high knowledge in Materials Engeneering and mechanical.
• Proficiency with Microsoft Office tools.
• Experience in lab environment (mandatory).
• Good written and verbal communication skills in English (mandatory).
• Team working and colaboration ability.
• Adaptability and Flexibility.
• Critical thinking and problem solving skills.
• Communicative, responsible and time management/organization skills.

Responsabilidades

• Investigation of Cu-pillar Underfill for Semiconductor Applications.
• State-of-the-art Review of Underfill in the semiconductor industry.
• Identification of relevant material properties and influence on reliability.
• Material Characterization (Thermal analysis, Rheology, Chemical analysis, DMA and TMA).
• Shear/adhesion strength method implementation in Bosch BrgP.
• Definition of test method for Nano-identation measurements in Bosch BrgP.

Conhecimentos

Materials characterization techniques

Chemical analysis

Material science

Testing and statistical methods

Lab environment

English communication

Teamwork

Adaptability

Problem solving

Time management

Formação académica

Materials Engineering

Ferramentas

Microsoft Office

Descrição da oferta de emprego

Bosch Car Multimedia, S.A. invites applications for a position focusing on the investigation of Cu-pillar underfill for semiconductor applications.

The role involves literature review, material property analysis, and comprehensive material characterization in collaboration with Bosch BrgP and University of Minho. The project will be conducted in Bosch BrgP labs and production environments, with testing at the University of Minho, including DMA and TMA, requiring strong communication in English