Yield & Process Engineer – Die Attach & Wirebond

Fastech; Cabuyao; On-site; PHP 600,000 - 800,000; Full time

Job summary

Fastech is seeking an engineer in Laguna to maintain and improve frontline yield through robust corrective actions and preventive measures. The role focuses on Die Attach, Wirebond, and related processes, including wafer saw and wafer dicing, with exposure to Eutectic, Soft Solder, and Epoxy technologies.

The ideal candidate holds an engineering degree (preferably BS ECE) and has hands-on experience in a manufacturing setting, including PC simulation and documentation tools.

Qualifications

• Engineering degree required, preferably BS in ECE.
• Preferably 3 years of related manufacturing experience.
• Knowledge of Die Attach, Wirebond, Wafer Dicing, and PC simulation/docs software.

Responsibilities

• Set corrective actions and preventive measures to assure and maintain front-of-line yield performance (Wafer saw, Die attach & Wirebond).
• Handle all Die Attach technology processes (Eutectic, Soft Solder, Epoxy).

Skills

Die Attach

Wirebond

Wafer Dicing

Simulation & Docs software

Education

BS ECE

Tools

PC simulation software

Job description

Fastech is seeking an engineer in Laguna to maintain and improve frontline yield through robust corrective actions and preventive measures. The role focuses on Die Attach, Wirebond, and related processes, including wafer saw and wafer dicing, with exposure to Eutectic, Soft Solder, and Epoxy technologies.

The ideal candidate holds an engineering degree (preferably BS ECE) and has hands-on experience in a manufacturing setting, including PC simulation and documentation tools.