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Fastech is seeking an engineer in Laguna to maintain and improve frontline yield through robust corrective actions and preventive measures. The role focuses on Die Attach, Wirebond, and related processes, including wafer saw and wafer dicing, with exposure to Eutectic, Soft Solder, and Epoxy technologies.
The ideal candidate holds an engineering degree (preferably BS ECE) and has hands-on experience in a manufacturing setting, including PC simulation and documentation tools.
Responsible for setting corrective action and preventive measure to assure and maintain the Front of line yield performance. (Wafer saw, Die attach & Wirebond). Handles all Die Attach technology process (Eutectic, Soft Solder, and Epoxy technology)
Any engineering course - Preferably BS ECE
Preferably with 3 years related work experience in a manufacturing company
With skills and knowledge in Die Attach, Wirebond, Wafer Dicing, and any other PC simulation/Docs software