Staff Product & Test Development Engineer

Onsemi; Hinoba-an; On-site; PHP 800,000 - 1,100,000; Full time

Job summary

Onsemi in the Philippines seeks a seasoned Test/Product Engineer to drive process capability, yield improvement, and defect reduction across assembly and test. You will collaborate with assembly, product, and fab teams to release products on schedule and support APQP deliverables.

The role requires a Bachelor’s degree in Electrical or Micro-electronics and 7+ years in semiconductor test/production. Proficiency in VB, VC/C++, and JMP is expected, with strong DFMEA and data-analysis skills.

Qualifications

• Proficient in test and product engineering for semiconductor devices.
• Experience with power discrete devices and module packaging.
• Knowledge of reliability and failure modes in semiconductor testing.

Responsibilities

• Work with Assembly, Product, and Fab teams to release products on time.
• Capture failure modes and reflect to DFMEA RPN; drive action owners.
• Provide on-schedule APQP test deliverables for marketing releases.
• Secure POR to meet back-end KPI requirements (Quality, Cost/Yield, Cycle Time).
• Develop test platform roadmaps and robust test solutions.
• Review test coverage and guard bands; leverage lessons learned.
• Set Maverick limits for new production and manage PAT criteria.
• Establish auto pre-alerts for suspicious wafers with FAB.
• Analyze data, perform fault analysis, and improve yield and quality.

Skills

VB

VC/C++

DFMEA knowledge

Data analysis

Education

Bachelor’s degree in Electrical or Micro-electronics

Tools

JMP

Job description

Job Description

Job Summary:

Maintain and continually improve process capability, yield, and reduce defect PPM, optimize operation spec, and provide training to operation staff, timely close line abnormal, support EON and NPI activity, support machine qualification and buyoff.

Responsibilities

Responsibilities

Work together with Assembly, Product, Fab team for product release to mass product in time.

o Familiar with project management procedures

o Capture all potential failure mode and reflect to DFMEA RPN. Reduce high RPN by driving action owner.

o Provide on schedule APQP test deliverables to meet marketing release time.

o Responsible to secure POR to meet back-end manufacturing KPI requirements (Quality, Cost/Yield, Cycle Time).

o Test platform/solution roadmap for new test solution development or setup.

o Responsible for robust test solution development with early design review involvement to meet design for test requirement.

o Establish robust test coverage, guard band in final test area, familiar with assembly failure modes, capture into characterization of test sensitivity and screen ability.

o Initiate to review test coverage & guard band with previous lesson learns to secure new device performance in both Quality and Yield.

o Maverick limit adjustment and initiate PAT limit for new production to capture all excursed units.

o Establish auto pre-alert on “suspecting” wafers with FAB for early detection.

Initiate test maverick criteria and process control specs/WI update and maintenance. Maverick lots dispose, data analysis, failure mode analysis.

Responsible for yield improvement & quality enhancement to stabilize device performance at post code S ramp up.

Lead ship to address related Assy/FAB process owner for improvement on key FT failure items. Key failure mode risk assessment, decision making.

Statistical analysis on electrical characterization & reliability drifting analysis.

Support customer related activities as needed.

Ownership for test area, test engineer activities management, build team capabilities, various cultures.

Qualifications

Requirements:

Bachelor’s degree in Electrical, Micro-electronics, or relative specialty.

7+ years’ product or test engineering experience of semiconductor device such as power discrete (BJT, MOSFET, IGBT, Diode), multi-chip functional power module, analog switch, PWM, power conversion IC, etc.

Good knowledge of key power discrete and Module package and key assembly process. Good capability for issue solving, risk assessment, dispose. Data analysis, statistical tooling using, such as JMP.

Good knowledge of product reliability items and application with failure mode of device.

Good at VB, VC/C++, familiar with high power test platform, such like ETS, etc.

Good English communication skills including verbal and written.

Team player with good interpersonal skills and able to work efficiently with multi-functional groups across different department and location.

Proactive, self-motivated, result/goal oriented and be willing to face pressure and challenge.

Requirements:

Bachelor’s degree in Electrical, Micro-electronics, or relative specialty.

7+ years’ product or test engineering experience of semiconductor device such as power discrete (BJT, MOSFET, IGBT, Diode), multi-chip functional power module, analog switch, PWM, power conversion IC, etc.

Good knowledge of key power discrete and Module package and key assembly process. Good