Staff Assembly Engineer 2 months ago

Navitas Semiconductor; Muntinlupa; On-site; PHP 800,000 - 1,100,000; Full time

Job summary

Navitas Semiconductor in the Philippines is seeking a seasoned Process Engineer to drive assembly process characterization and risk mitigation for NPI products. You will partner with subcontractors to refine leadframe design and BOMs, manage tooling quotes, and oversee PO releases and deliveries.

You will review process specs, ensure cross-team approvals, and lead on-site execution with the subcontractor and global teams. Strong problem-solving and DOE knowledge are highly valued.

Qualifications

• Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering or related majors.
• Fluent in English in writing and speaking.
• At least 5 years process engineering experience in a Semiconductor backend facility.
• Experience with Wafer Saw, Laser Groove, DB, WB or EOL Assembly is preferred.
• Experience with Engineering Problem Solving tools: FMEA, SPC, Control plan, OCAP, 8D, MSA; DOE knowledge is a plus.
• Experience in the whole Assembly Process from Dicing to Singulation & Tape & Reel is preferred.

Responsibilities

• Work with subcontractors on Assembly Processes Characterization.
• Risk reviews for New Product/Package introductions and create evaluations based on identified risks.
• Review or generate Process specs and documents; obtain approvals from multiple teams.
• Collaborate with Subcontractors on leadframe design, BOM, NRE tooling quotes, PO release and delivery.
• Manage and prevent risks in running NPI products in assembly; monitor and follow up on critical NPI builds.
• Support investigation and resolution of quality, yield and customer return issues.
• Lead on-site execution with the Subcon team and coordinate with global teams.
• Use project management tools to manage NPI activities from characterization to Mass Production Release.

Skills

Process engineering

English fluency

Wafer Saw

Laser Groove

DB

WB

EOL Assembly

FMEA

SPC

Control plan

OCAP

8D

MSA

DOE

Education

Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering

Job description

Key Responsibilities And Duties Work with subcontractors on Assembly Processes Characterization.

Risk base review on New Product/Package Introduced and create evaluation based on the risk identified. Will follow thru execution and closure.

Review or generate Process specs and other documents, follow up review and approval by different teams within the organization. Work with Subcontractors in designing and improving leadframe, BOM. Work with Subcontractors on NRE tooling quote, PO release and delivery.

Manage and prevent risks in running NPI products in assembly, closely monitor and on-site follow up on critical NPI builds. Support investigation and resolution of quality, yield and customer return issue. Daily sustaining to smooth the normal production.

Regular online meeting with cross functional team (NPI, Delivery, Quality and Customer related). Lead overall execution locally at Subcon side together with global team. Use Project management tool is an advantage to manage NPI activities in subcon from process characterization to assembling Qualification lots to Mass Production Release.

Qualifications Required Qualifications Basic

Bachelor degree or above in Mechanical Automation, Materials Science, Electrical Engineering, or related majors. Must be fluent in English in writing and speaking. Must have at least 5 years process engineering experience in a Semiconductor backend facility.

Experienced with Wafer Saw, Laser Groove or DB or WB or EOL Assy. Advantage to have average understanding in the whole Assembly Process.

Experienced with Engineering Problem Solving Tool like FMEA, SPC, Control plan, OCAP, 8D, MSA. Advantage on expert user on DOE.

Preferred Experienced in the whole Assembly Process (from Dicing to Singulation & Tape and Reel)