ENGR STAFF, PACKAGE DEVELOPMENT

onsemi; Carmona; On-site; PHP 900,000 - 1,300,000; Full time

Job summary

onsemi is seeking an experienced engineer to drive new package development from concept through prototype validation. You will collaborate with labs and providers for POC initiatives and manage technology transfer to development sites.

The role requires hands-on assembly development, strong analytical skills, and project management experience within the semiconductor packaging domain.

Qualifications

• Analytical skills to assess processes, materials and assembly equipment parameters.
• Hands-on experience in program management and project coordination.
• Experience in assembly development and semiconductor processes.
• Background in materials science, electronics or mechanical disciplines.

Responsibilities

• Lead New Package Development from concept to fully functional prototypes.
• Establish linkages with POC labs/providers for equipment, materials and services.
• Conduct POC builds and technology demonstrations with providers.
• Benchmark processes and technologies used in package development.
• Provide POC costing and project timing information to stakeholders.
• Transfer technology to development sites and coordinate risk reviews.

Skills

Analytical skills

Program management

Hands-on assembly development

Materials/process knowledge

Education

Bachelor's/Master in relevant engineering

Job description

Job Description

• New package development -from conceptualization and ideation to creation of fully functional prototypes.
• Find/Create linkages with POC labs/providers (Eqpt, Material, Service providers)
• Physically conduct POC builds and/or technology demonstration with Provider
• Provides POC development costing and project timing
• Follows the New Package Technology Development (12MON47078H) and H3 Ideation Flow
• Make sure we are covered with the Intellectual Property prior engagement
• Generate/Present POC and/or Technology demonstration reports to Stakeholders
• Provides intelligence on Package Technology/Market
• Responsible for New Package Development. Conducts tests and research on basic materials and properties involved in packaging. Develops solutions.
• Provides recommendations regarding technical approach or design, resource allocation, or project timing.
• Works with general guidance but independently determines the best approach for solving a problem.
• Conducts Design reviews and risk assessments with participation by other technical experts
• Manages the Technical risks of the projects assigned to ensure deployment of mitigation actions as per committed project timing
• Strong interaction with Manufacturing, Reliability and Business Units to close engineering gaps and for smooth production transfer.

Job Description

• New package development -from conceptualization and ideation to creation of fully functional prototypes.
• Find/Create linkages with POC labs/providers (Eqpt, Material, Service providers)
• Physically conduct POC builds and/or technology demonstration with Provider
• Benchmark processes/technologies
• Provides POC development costing and project timing
• Follows the New Package Technology Development (12MON47078H) and H3 Ideation Flow
• Make sure we are covered with the Intellectual Property prior engagement
• Generate/Present POC and/or Technology demonstration reports to Stakeholders
• Technology Transfer to development site
• Provides intelligence on Package Technology/Market
• Responsible for New Package Development. Conducts tests and research on basic materials and properties involved in packaging. Develops solutions.
• Provides recommendations regarding technical approach or design, resource allocation, or project timing.
• Works with general guidance but independently determines the best approach for solving a problem.
• Conducts Design reviews and risk assessments with participation by other technical experts
• Manages the Technical risks of the projects assigned to ensure deployment of mitigation actions as per committed project timing
• Strong interaction with Manufacturing, Reliability and Business Units to close engineering gaps and for smooth production transfer.

Qualifications

• Bachelors/Master of appropriate technical discipline; ie. Physics, Electrical Engineering, Chemical Engineering, Materials Science, Mechanical Engineering, Electronics and Communications Engineering
• 8 years of experience in semiconductor manufacturing, particularly in New Package/Product Development
• Hands-on assembly development and manufacturing experience.
• Analytical skills: process, materials and assembly equipment parameters
• Hands-on experience in program management

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.