Senior Package Development Engineer: Yield & Innovation

Allegro MicroSystems, LLC; Hinoba-an; On-site; PHP 1,200,000 - 1,800,000; Full time

Job summary

Allegro MicroSystems, LLC is seeking a Lead Engineer for Package Development to drive new product design to production, optimize test strategies, and lead validation efforts. You will oversee yield improvement, cost reduction, and conformance to specifications while coordinating with suppliers and internal teams.

The role requires deep expertise in semiconductor packaging, DFMEA/DRBFM, and DOE-driven process optimization to ensure on-time releases and robust product quality across advanced

Qualifications

• 15+ years experience in Package Development or NPI in semiconductor assembly.
• Experience with leadframe and substrate-based packages and failure analysis.
• Expertise in DFMEA/DRBFM and design for manufacturability.

Responsibilities

• Define test strategies and validation plans for new packages.
• Lead yield improvement and cost-reduction initiatives.
• Develop and qualify assembly processes and equipment.
• Prepare technical reports and communicate results to stakeholders.

Skills

15+ years experience

Statistical methods

Package design

Education

Mechanical Engineering

Electrical Engineering

Materials Engineering

Tools

DOE

SAS-JMP

Minitab

DRBFM/DFMEA

Job description

Allegro MicroSystems, LLC is seeking a Lead Engineer for Package Development to drive new product design to production, optimize test strategies, and lead validation efforts. You will oversee yield improvement, cost reduction, and conformance to specifications while coordinating with suppliers and internal teams.

The role requires deep expertise in semiconductor packaging, DFMEA/DRBFM, and DOE-driven process optimization to ensure on-time releases and robust product quality across advanced