Lead Package Development Engineer | Yield & Quality

Allegro MicroSystems; Metro Manila; On-site; PHP 1,300,000 - 2,100,000; Full time

Job summary

Allegro MicroSystems is seeking a Lead Engineer for Package Development to drive new product introductions from design to production. You will lead test strategies, validation, and yield improvements for complex packages.

The role requires deep expertise in semiconductor assembly, mold simulations, and DFMEA, with strong leadership and communication skills to coordinate with suppliers and internal teams.

Qualifications

• Subject matter expert with at least 15 years’ experience in Package Development and NPI in semiconductor assembly.
• Strong knowledge of mold simulations, tooling designs, and process qualification.
• Experience with DFMEA/DRBFM and design for manufacturability.

Responsibilities

• Set up and optimize processes for new packages; define test strategies.
• Lead validation efforts and drive yield improvements for complex products.
• Develop and qualify jigs, fixtures, and tools; monitor equipment performance.
• Source and evaluate materials to reduce cost and improve quality.
• Coordinate quality and reliability issues with internal/external partners.

Skills

Package Development

New Product Introduction

Semiconductor assembly

Failure analysis

Mold simulations

DFMEA/DRBFM

Statistical methods (DOE, SAS-JMP, Min

Process capability

Quality documentation

Team leadership

Education

Engineering degree (ME/EE/Materials etc.)

Tools

CSAM

Cross Section

SEM

SAS-JMP

Minitab

Job description

Allegro MicroSystems is seeking a Lead Engineer for Package Development to drive new product introductions from design to production. You will lead test strategies, validation, and yield improvements for complex packages.

The role requires deep expertise in semiconductor assembly, mold simulations, and DFMEA, with strong leadership and communication skills to coordinate with suppliers and internal teams.