Lead Engineer Packaging Project

Allegro MicroSystems; Metro Manila; On-site; PHP 3,757,000 - 6,888,000; Full time

Job summary

Allegro MicroSystems in Metro Manila seeks a Lead Engineer, Packaging Project to drive packaging designs, oversee cross-functional teams, and ensure on-time, on-budget delivery with strict quality standards.

You will lead qualification plans, review BOMs, apply APQP and quality tools (DFMEA, PFMEA, Ishikawa), participate in Ishikawa/8D analyses, and maintain thorough project documentation while training new staff.

Qualifications

• BS in an engineering field as listed in the job posting.
• Strong project management and decision-making experience in semiconductor packaging and assembly.

Responsibilities

• Manage and execute packaging projects on time, within budget, and within scope.
• Participate in BOM selection and make recommendations based on requirements.
• Develop and execute qualification plans and collect tests/data.
• Provide disposition on Reliability Test concerns.
• Review assembly data and qualification data, identify issues, and propose solutions.
• Contribute to package design/process improvement discussions.
• Track milestones and proactively address delays or issues.
• Escalate risks and resource conflicts to the Technical Project Manager.
• Collaborate with design, product lines, manufacturing, and quality teams.
• Ensure APQP adherence and internal documentation procedures.
• Participate in problem-solving activities like Ishikawa or 8D analyses.
• Utilize DFMEA, PFMEA, Ishikawa, DRBFM, DFM/DFQ/DFC concepts.
• Maintain project documentation including schedules, budgets, and specs.
• Conduct familiarization training for new personnel.
• Prepare weekly/monthly project highlights and monitor activities.
• Perform other related duties as assigned by supervisor.

Skills

Project management

Attention to detail

Problem solving

English fluency

Communication

Education

Bachelor's degree in Engineering (ECE, Mechanical, Chemical, Electrical, IE)

Tools

Excel

PowerPoint

Job description

Job Description:

The Allegro team is united by a clear purpose—advancing technologies that make the world safer, more efficient, and more sustainable. With over 30 years of experience in semiconductor innovation, we bring that purpose to life across every part of the business—from breakthrough product development and customer success to how we show up for each other and the communities we serve.

The Opportunity

This role requires the ability to make critical decisions regarding package design, lead assembly process engineering efforts, and drive problem-solving and optimization. The Lead Engineer, Packaging Project will ensure projects adhere to scope, schedule, budget, and quality requirements, collaborate effectively with cross-functional teams, proactively manage risks, and ensure all deliverables meet Allegro's internal procedures and stringent quality standards. This level also contributes to the management and updating of package design rules.

What You Will Do

• Manage and execute assigned packaging projects, ensuring they are completed on time, within budget, and within scope.
• Participate in bill of material selection, making recommendations based on technical requirements and project objectives.
• Develop and execute qualification plans, ensuring all necessary tests and data are collected
• Provide engineering disposition on Reliability Test concerns
• Perform detailed assembly data review and qualification data review, identifying issues and proposing solutions.
• Contribute to technical discussions on package design and assembly process improvements.
• Track critical tasks and milestones, proactively identifying and addressing potential delays or issues.
• Identify, document, and escalating project risks and minor resource conflicts to the Technical Project Manager.
• Collaborate with cross-functional teams, including design, product lines, manufacturing, and quality, to ensure seamless project execution.
• Ensure all project deliverables adhere to Advanced Product Quality Planning (APQP) requirements and internal documentation procedures.
• Participate in problem-solving activities, such as Ishikawa (Fishbone) or 8D analyses, when project issues arise.
• Effectively utilize quality tools such as DFMEA, PFMEA, Ishikawa, DRBFM, Design for Manufacturability, Design for Quality, and Design for Cost.
• Maintain comprehensive project documentation, including schedules, budgets, and technical specifications.
• Conducts familiarization training for new personnel with similar job functions.
• Prepares weekly/monthly highlights of all projects and activities made. Monitors projects and activities.
• Performs other related duties that may be assigned by the immediate superior.

What You Will Bring

• Bachelor's degree (BS) in an engineering field such as Electronics and Communication Engineering, Mechanical Engineering, Chemical Engineering, or Electrical Engineering, Industrial Engineering, Manufacturing Engineering, Metallurgical Engineering
• Minimum of five (5) years of experience in semiconductor packaging and assembly engineering, with a proven track record of technical project management and decision-making.
• Demonstrated expertise in semiconductor packaging and assembly processes, with the ability to make design and process engineering decisions.
• Strong understanding and practical application of project management principles, with an emphasis on technical leadership.
• Highly organized with exceptional attention to detail and strong problem-solving skills.
• Excellent written and spoken English language fluency, with strong communication and interpersonal skills.
• Proficiency in Microsoft Excel and Microsoft PowerPoint.

Why Allegro?

Join Allegro and become part of a team where your contributions truly matter.

We foster a culture of Real Innovation, empowering you to push boundaries, develop cutting-edge solutions, and drive continuous improvement.

Your work will create a Real Impact by solving complex real-world challenges that fuel our success and shape the future of technology.

You’ll experience Real Connection, collaborating with talented colleagues around the globe in an environment built on trust, respect, and a shared purpose.