Postdoc: Wafer Bonding Physics for 3D Chip Integration

Karlstad University; Enschede; On-site; EUR 41,000 - 64,000; Full time

Benefits offered by this job

Holiday allowance 8%

Year-end bonus 8.3%

Solid pension scheme

Good sports facilities access

Support for research and development

Job summary

University of Twente is seeking a PostDoc in Wafer Bonding Physics for 3D Chip Integration. You will develop and validate experimental methods to study wafer bonding in a quantitative, physics-based way and work in the XUV Optics group.

You will perform wafer bonding measurements, combine with surface metrology, and aim to relate surface properties to bonding performance, collaborating with industrial partners.

Qualifications

• PhD in a related field (materials science, surface science, physics, chemistry, nanotechnology, or mechanical engineering).
• Experience in experimental research on surfaces, interfaces, thin films and wafer processing.
• Familiarity with characterization techniques such as AFM, WLI, contact-angle, XPS, FTIR or ellipsometry.
• Interest in linking experimental results to physical models and quantitative analysis.
• Hands-on attitude with advanced lab equipment and independent work capability.

Responsibilities

• Develop and validate experimental methods to study wafer bonding in a quantitative, physics-based way.
• Conduct wafer bonding measurements and combine results with advanced surface metrology.
• Aim for predictive relations between surface properties and bonding performance for 3D chip integration.
• Collaborate with industrial partners and work in an interdisciplinary environment.

Skills

English proficiency

Independent researcher

Team collaboration

Education

PhD in materials science

PhD in surface science

PhD in applied physics

PhD in physical chemistry

PhD in nanotechnology

PhD in mechanical engineering

Tools

AFM

WLI

Contact-angle measurements

XPS

FTIR

Ellipsometry

Infrared metrology

Job description

University of Twente is seeking a PostDoc in Wafer Bonding Physics for 3D Chip Integration. You will develop and validate experimental methods to study wafer bonding in a quantitative, physics-based way and work in the XUV Optics group.

You will perform wafer bonding measurements, combine with surface metrology, and aim to relate surface properties to bonding performance, collaborating with industrial partners.