PostDoc position on Wafer Bonding Physics for 3D Chip Integration

Karlstad University; Enschede; On-site; EUR 41,000 - 64,000; Full time

Benefits offered by this job

Holiday allowance 8%

Year-end bonus 8.3%

Solid pension scheme

Good sports facilities access

Support for research and development

Job summary

University of Twente is seeking a PostDoc in Wafer Bonding Physics for 3D Chip Integration. You will develop and validate experimental methods to study wafer bonding in a quantitative, physics-based way and work in the XUV Optics group.

You will perform wafer bonding measurements, combine with surface metrology, and aim to relate surface properties to bonding performance, collaborating with industrial partners.

Qualifications

• PhD in a related field (materials science, surface science, physics, chemistry, nanotechnology, or mechanical engineering).
• Experience in experimental research on surfaces, interfaces, thin films and wafer processing.
• Familiarity with characterization techniques such as AFM, WLI, contact-angle, XPS, FTIR or ellipsometry.
• Interest in linking experimental results to physical models and quantitative analysis.
• Hands-on attitude with advanced lab equipment and independent work capability.

Responsibilities

• Develop and validate experimental methods to study wafer bonding in a quantitative, physics-based way.
• Conduct wafer bonding measurements and combine results with advanced surface metrology.
• Aim for predictive relations between surface properties and bonding performance for 3D chip integration.
• Collaborate with industrial partners and work in an interdisciplinary environment.

Skills

English proficiency

Independent researcher

Team collaboration

Education

PhD in materials science

PhD in surface science

PhD in applied physics

PhD in physical chemistry

PhD in nanotechnology

PhD in mechanical engineering

Tools

AFM

WLI

Contact-angle measurements

XPS

FTIR

Ellipsometry

Infrared metrology

Job description

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PostDoc position on Wafer Bonding Physics for 3D Chip Integration

Looking for a job that matters? Join the university of technology that puts people first – and shape new opportunities both for yourself and for ou...

Wafer-to-wafer bonding is a key enabling technology for future 3D chip integration, where chips are stacked and interconnected to create faster, more compact and more energy-efficient semiconductor devices. However, the detailed mechanisms that determine bonding quality are still not sufficiently understood. In particular, the interplay between surface properties, wafer morphology, and the resulting bonding performance is still largely optimized empirically.

In this postdoctoral project, you will develop and validate experimental methods to study wafer bonding in a quantitative and physics-based way. You will work on wafer bonding measurements and combine these with advanced surface metrology. It is relevant to have experience with analysis techniques such as AFM, WLI, contact-angle, XPS, infrared metrology.

You will work in the XUV Optics group at the University of Twente, embedded in the MESA+ Institute for Nanotechnology. The project offers a combination of hands-on experimental work, data analysis, physical interpretation and close interaction with industrial partners. You will contribute to a scientifically challenging and industrially relevant topic, with the aiming at predictive relations between measurable wafer surface properties and bonding performance for next-generation 3D chip integration.

Your profile

• You have a PhD degree in materials science, surface science, applied physics, physical chemistry, nanotechnology, mechanical engineering, or a related field.
• You have experience with experimental research on surfaces, interfaces, thin films, wafer processing, adhesion, or semiconductor-related materials.
• You are familiar with one or more relevant characterization techniques, such as AFM, WLI, contact-angle measurements, XPS, FTIR, infrared metrology, ellipsometry, or related surface-analysis methods.
• You are interested in connecting experimental results to physical models and quantitative data analysis.
• You enjoy hands-on experimental work and are able to work accurately with advanced laboratory equipment.
• You have a creative mindset, work independently, and are motivated to address a challenging scientific problem with industrial relevance.
• You have a good team spirit and enjoy working in an interdisciplinary environment with academic and industrial partners.
• You are proficient in English and able to communicate your results clearly in meetings, reports, and scientific publications.

Our offer

• You will be appointed for a period of maximum 2 years full-time within a very stimulating scientific environment. The university offers a dynamic ecosystem with enthusiastic colleagues.
• Your salary and associated conditions are in accordance with the collective labour agreement for Dutch universities (CAO-NU);
• Gross salary between € 3.706,- (step 0) and € 5.760,- (step 12) per month depending on experience and qualifications;
• Excellent benefits including a holiday allowance of 8% of the gross annual salary, a year-end bonus of 8.3% and a solid pension scheme;
• Free access to sports facilities on campus
• A minimum of 232 leave hours in case of full-time employment based on a formal workweek of 38 hours. A full-time employment in practice means 40 hours a week, therefore resulting in 96 extra leave hours on an annual basis;
• Excellent support for research and facilities for professional and personal development;
• We encourage a high degree of responsibility and independence, while collaborating with close colleagues, researchers and other university staff. We are also a family-friendly institution that offers parental leave (both paid and unpaid) and career support for partners.

Information and application

• A cover letter (maximum 2 pages A4), emphasizing your specific interest, qualifications, motivations to apply for this position.
• A Curriculum Vitae, including a list of all courses attended and grades obtained, and, if applicable, a list of publications and references.
• Proof of English proficiency (IELTS or TOEFL), if available.

For more information regarding this position, you are welcome to contact Dr.ir. Wesley van den Beld, [emailprotected]

About the department

The University of Twente stands for life sciences and technology: high tech and human touch. Its education and research focus on technology that drives innovation and societal progress. The University of Twente is the only campus university in the Netherlands and offers an open, collaborative and entrepreneurial research environment.

The XUV Optics Group is embedded in the MESA+ Institute for Nanotechnology, one of the largest nanotechnology research institutes in the world. The group performs fundamental and applied research on thin films, surfaces, interfaces and optical materials, with strong relevance to high-tech applications and close collaboration with industrial partners. The MESA+ NanoLab provides extensive cleanroom infrastructure and state-of-the-art tools for materials fabrication, surface analysis and nanoscale characterization. The University of Twente is an equal opportunity employer and values diversity. We encourage applications from candidates of all backgrounds and particularly welcome applications from groups that are underrepresented in science and engineering.

About the organisation

The Faculty of Science & Technology (Technische Natuurwetenschappen, TNW) engages some 700 staff members and 2000 students in education and research on the cutting edge of chemical technology, applied physics and biomedical technology. Our fields of application include sustainable energy, process technology and materials science, nanotechnology and technical medicine. As part of a people-first tech university that aims to shape society, individuals and connections, our faculty works together intensively with industrial partners and researchers in the Netherlands and abroad, and conducts extensive research for external commissioning parties and funders. Our research has a high profile both in the Netherlands and internationally and is strengthened by the many young researchers working on innovative projects with as doctoral candidates and post-docs. It has been accommodated in three multidisciplinary UT research institutes: Mesa+ Institute, TechMed Centre and Digital Society Institute.

Job details

Title

PostDoc position on Wafer Bonding Physics for 3D Chip Integration

Looking for a job that matters? Join the university of technology that puts people first – and shape new opportunities both for yourself and for ou...