PhD: Multi-Material 3D Printing for Ultra Efficient Chip Cooling

Utwentecareers; Enschede; On-site; EUR 37,000 - 47,000; Full time

Benefits offered by this job

Fully funded PhD

Excellent facilities

Job summary

The University of Twente offers a fully funded 4-year PhD position focused on developing ultra-efficient cooling technologies for advanced semiconductor packaging. The project combines materials science, additive manufacturing, thermal engineering and integration to enable direct bonding between silicon and high-conductivity metals.

You will work in an interdisciplinary environment with academic researchers and industrial partners, employing LPBF, interlayer alloy design, and advanced

Qualifications

• Master’s degree in Mechanical Engineering or Materials Science and Engineering or related field.
• Strong interest in additive manufacturing, materials development, thermal management and semiconductor packaging.
• Experience with materials characterization techniques (SEM, EBSD, XRD, thermal characterization, mechanical testing) is desirable.
• Familiarity with LPBF processes is an advantage.
• Excellent communication skills and English proficiency.

Responsibilities

• Design interlayer alloy feedstocks and powder production.
• Optimize multi-material LPBF process parameters for cooling demonstrators.
• Fabricate and validate package-level cooling demonstrators for chip cooling applications.
• Collaborate with interdisciplinary researchers and industrial partners.
• Contribute to fundamental research with strong industrial relevance.

Skills

Additive manufacturing

Thermal management

Analytical skills

Problem solving

English proficiency

Education

Master’s degree in Mechanical Engineering or Materials Science and Engineering

Tools

Laser Powder Bed Fusion

Job description

The University of Twente offers a fully funded 4-year PhD position focused on developing ultra-efficient cooling technologies for advanced semiconductor packaging. The project combines materials science, additive manufacturing, thermal engineering and integration to enable direct bonding between silicon and high-conductivity metals.

You will work in an interdisciplinary environment with academic researchers and industrial partners, employing LPBF, interlayer alloy design, and advanced