PhD: Multi-Material AM for High-Performance Chip Cooling

AcademicTransfer; Netherlands; On-site; EUR 34,000 - 43,000; Full time

Benefits offered by this job

Fully funded 4-year PhD

Excellent facilities and international

Dutch CAO salary alignment and solidp

Pension scheme

Job summary

University of Twente offers a fully funded 4-year PhD position focusing on ultra-efficient cooling technologies for advanced semiconductor packaging. The project integrates materials science, additive manufacturing, thermal engineering and semiconductor integration to enable direct bonding between silicon and high-conductivity metals.

The research includes design of interlayer alloys, LPBF process optimization, and thermal transport studies, with access to SEM, EBSD, XRD, and thermo‑mechanical

Qualifications

• Master’s degree in Mechanical Engineering or Materials Science and Engineering or another relevant field.
• Strong interest in additive manufacturing, materials development, and thermal management.
• Experience with materials characterization techniques (SEM/EBSD/XRD) and mechanical testing is desirable.

Responsibilities

• Design interlayer alloy feedstocks for thermal management applications.
• Develop multi-material LPBF processes for semiconductor packaging.
• Investigate interfacial physics, residual stress, and thermal transport across Cu–Si interfaces.
• Fabricate and validate package-level cooling demonstrators for chip cooling applications.
• Collaborate with international researchers and industrial partners in semiconductor packaging.

Skills

Additive manufacturing

Thermal management

Materials development

Analytical skills

English proficiency

Education

Master’s in Mechanical Engineering

Master’s in Materials Science & Eng

Tools

SEM

EBSD

XRD

Laser Powder Bed Fusion

Job description

University of Twente offers a fully funded 4-year PhD position focusing on ultra-efficient cooling technologies for advanced semiconductor packaging. The project integrates materials science, additive manufacturing, thermal engineering and semiconductor integration to enable direct bonding between silicon and high-conductivity metals.

The research includes design of interlayer alloys, LPBF process optimization, and thermal transport studies, with access to SEM, EBSD, XRD, and thermo‑mechanical