Lead Systems Engineer: Die-Bonding & V-Model Integration

Independent Recruiters; Nijmegen; On-site; EUR 45,000 - 61,000; Full time

Job summary

Independent Recruiters seeks an experienced Systems Engineer to spearhead the V-model integration for a next-generation die bonding machine platform in a high-volume semiconductor environment. The role focuses on translating requirements into actionable integration plans and safeguarding interfaces across mechanics, electronics, software, and process.

The ideal candidate holds a master's degree in a related field, has several years in system integration or multidisciplinary equipment

Qualifications

• Master's degree in Mechanical Engineering, Mechatronics, Electrical Engineering, Physics, or related field.
• Several years of experience in system integration, systems engineering, prototype realization, or multidisciplinary equipment development.
• Strong understanding of interfaces, technical dependencies, verification logic, and engineering change impact.
• Experience working with suppliers, development partners, or subcontractors.
• Strong analytical skills, clear communication, and a proactive mindset.

Responsibilities

• Drive the integration part of the V-model from modules to a fully integrated prototype.
• Translate system requirements into an integration approach, including build sequencing and testing.
• Safeguard interfaces across mechanics, electronics, software, and process.
• Coordinate with development partners and subcontractors on deliverables and planning.
• Provide hands-on integration support at the machine during build and test.
• Manage dependencies, risks, gaps, and tech maturity for integration, verification and validation.

Skills

Systems engineering

Interface management

Multidisciplinary development

Analytical thinking

Communication

Education

Master's degree in Mechanical Engineering, Mechatronics, Electrical Engineering, Physics

Job description

Independent Recruiters seeks an experienced Systems Engineer to spearhead the V-model integration for a next-generation die bonding machine platform in a high-volume semiconductor environment. The role focuses on translating requirements into actionable integration plans and safeguarding interfaces across mechanics, electronics, software, and process.

The ideal candidate holds a master's degree in a related field, has several years in system integration or multidisciplinary equipment