Cryogenic RF/PCB Design Engineer for Quantum Systems

QuantWare BV; Delft; Hybrid; EUR 68,000 - 80,000; Full time

Benefits offered by this job

Competitive salary

Pension built to last

Flexibility built on trust

Personal growth

Connected team

Job summary

QuantWare BV in Delft is seeking an RF/PCB Design Engineer to drive the physical realization of our 3D quantum hardware. You will own the design of critical microwave components, create high-density cryo‑compatible PCB layouts, and help develop packaging solutions for large-scale QPUs.

Working at the intersection of hardware and software, you will collaborate with the packaging and product design teams, use KiCAD, Altium, and Cadence, and validate performance across cryogenic temperatures with

Qualifications

• Education in Electrical Engineering with PCB/RF focus (BSc/MSc).
• 4+ years hands-on PCB design using KiCAD, Altium, Cadence.
• Cryogenic hardware experience (dilution refrigerators, cryostats, or low-temp RF).
• Solid understanding of schematics, RF layout, impedance, and heat/cooling considerations.

Responsibilities

• Component & Mechanical Design: design electromechanical interfaces for QPUs and packaging.
• Precision Engineering: CAD-driven PCB, chip layout, and interconnects within VIO architecture.
• RF/Microwave Design: address insertion loss, impedance, and cross-talk at PCB/package levels.
• Cryogenic Integration & Testing: design and test across room temp to millikelvin ranges, including cooldown/characterisation tests.

Skills

Component & Mechanical Design

Precision Engineering

RF/Microwave Design

Cryogenic Applications

Education

BSc or MSc Electrical Engineering (PCB/RF focus)

Tools

KiCAD

Altium Designer

Cadence

Job description

QuantWare BV in Delft is seeking an RF/PCB Design Engineer to drive the physical realization of our 3D quantum hardware. You will own the design of critical microwave components, create high-density cryo‑compatible PCB layouts, and help develop packaging solutions for large-scale QPUs.

Working at the intersection of hardware and software, you will collaborate with the packaging and product design teams, use KiCAD, Altium, and Cadence, and validate performance across cryogenic temperatures with