Industrial Engineer

Carsem (M) Sdn. Bhd; Ipoh; On-site; MYR 67,000 - 112,000; Full time

Benefits offered by this job

Medical Education support

Dental Parking

Medical for immediate family

Car subsidy

Job summary

Carsem (M) Sdn. Bhd is seeking an experienced Industrial Engineer to lead factory layout optimization, line balancing, and capacity planning for its Assembly & Test operations in Malaysia.

You will transform data into actionable improvements and design efficient production flows across multiple lines. You will partner with Production, Engineering, and Operations to drive productivity and continuous improvement, using CAD tools to maintain layout drawings and apply Lean and MES concepts.

Qualifications

• Bachelor's degree in Engineering or related field.
• 5-7 years of semiconductor Assembly & Test experience.
• Knowledge of Lean Manufacturing and capacity planning.
• Proficient with AutoCAD for layout design.

Responsibilities

• Lead factory layout planning, line balancing, and space optimization projects.
• Develop capacity plans to support production demand and future growth.
• Analyze equipment utilization, production flow, bottlenecks, and operational efficiency.
• Plan and optimize manufacturing resources, including Assembly & Test equipment.
• Create and maintain factory layout drawings using CAD software.
• Use data analysis to identify improvement opportunities and recommend solutions.
• Work closely with Production, Engineering, Industrial Engineering, and Operations teams on expansion and improvement projects.
• Drive productivity, throughput, and capacity improvements through continuous improvement initiatives.

Skills

Layout planning

Line balancing

Capacity planning

Data analysis

CAD (AutoCAD)

Excel skills

Lean Manufacturing

OEE awareness

Education

Bachelor's degree in Engineering

Tools

AutoCAD

MRP systems

Process modeling

Job description

We are looking for an experienced Indsutrial Engineer to lead factory layout optimization, production capacity planning, and continuous improvement initiatives within a semiconductor manufacturing environment. This role is ideal for someone who enjoys turning data into actionable improvements while designing efficient production flows for Assembly & Test operations.

Key Responsibilities

Lead factory layout planning, line balancing, and space optimization projects.

Develop capacity plans to support production demand and future growth.

Analyze equipment utilization, production flow, bottlenecks, and operational efficiency.

Plan and optimize manufacturing resources, including Assembly & Test equipment.

Create and maintain factory layout drawings using CAD software.

Use data analysis to identify improvement opportunities and recommend solutions.

Work closely with Production, Engineering, Industrial Engineering, and Operations teams on expansion and improvement projects.

Drive productivity, throughput, and capacity improvements through continuous improvement initiatives.

Job Requirements

Bachelor's Degree in Engineering, Industrial Engineering, Manufacturing, or a related field.

5-7 years of experience in Semiconductor Assembly & Test manufacturing.

Knowledge of Lean Manufacturing, MRP systems, and capacity planning/modeling.

Good understanding of production line setup, equipment planning, and manufacturing processes.

Familiar with Assembly & Test processes and equipment such as Wire Bond, Die Attach, Molding, EDM, Test, and related operations.

Experience in factory layout planning, capacity planning, and process improvement.

Proficient in AutoCAD or similar CAD software for layout design.

Strong Excel skills with good analytical and problem-solving abilities.

Knowledge of OEE, MES, capacity planning systems, or manufacturing monitoring tools is an added advantage.

Strong communication and stakeholder management skills, with experience leading cross-functional improvement projects.

Unlock job insights

Hirer responsiveness Salary match Number of applicants

Consumer Electronics Manufacturing More than 10,000 employees

Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, and offers one of the widest range package & test portfolios in the world.

Founded in 1972, Carsem is among the most experienced companies in our industry and is recognized as one of the largest in unit volume production. We have over 6,000 employees and ship in excess of 100 million units each week and more than 65% of this volume is shipped as fully tested product. Carsem is a member of one of South East Asia's most successful corporations, the Hong Leong Group, who views semiconductors as a core business.

We have three high technology factories. Two are located in Ipoh, Malaysia, and a new third factory is located in Suzhou, China. The two factories in Malaysia, Carsem - M Site and Carsem - S Site, are 10 miles (16Km) apart. Ipoh is a 90 minute drive from Penang and 2.5 hours from Kuala Lumpur.

The factories are supported by extensive R&D and failure analysis staff and incorporate highly sophisticated, "state of the art" automated equipment, ensuring quality products which meet the exacting standards of all the automotive, telecom, computer and consumer goods industries. Both factories maintain world-class quality standards having achieved ISO/TS 16949, ISO-9001, ISO-14001 certifications and comply to the Sony Green Partner Program. They are supported with a global network of sales and technical support offices. The China factory, Carsem-Suzhou Ltd., is located in the province of Jiangsu, 50 miles (80Km) west of Shanghai. The new factory is 172K sq. ft. (16K sq. m.) and is on 645K sq. ft. (60K sq. m.) of land in the Suzhou Industrial Park. The construction was completed in January 2004, the staff has been through extensive training in Carsem's existing Malaysian factories and the assembly and test equipment to support the manufacture of the MLP (Micro Leadframe Package) Quad and Dual was installed during the second quarter of 2004. Customer qualifications were completed during the second quarter and the factory started shipping production volumes during the third quarter of 2004.

Product & Services

Product Groups Assembled at M Site: MLP MICRO I.C. PDIP (300/600 Mil), PLCC, SOIC (150Mil), MSOP (3.0mm), QSOP (150Mil) MICRO SOT 23, SOT66x, TSOT, SOT, TO92; SC 70 POWER TO220, DDPAK, SOT223 S Site

S Site commenced operations in April,1992. The factory has a total floor space of 384,000 sq. ft. (35,700 M2), a work force of 4,300 employees and the ability to expand by 270,000 sq. ft. (25,000 M2) in the future. Product Groups Assembled at S Site: MLP QUAD, DUAL ARRAY SSBGA, SSLGA, FTBGA, CBGA I.C. PDIP (300 Mil), PLCC, SOIC (150/300 Mil), QSOP (300 Mil), SSOP (5.3mm), TSSOP (4.4/ 6.1mm) QFP MQFP, LQFP, TQFP SiP System in Package

Other Information

VISION

"To be a World Class Company Offering Assembly, Test/Finishing Solutions to Semiconductor Companies Throughout the World"

MISSION

"Carsem will Continue to show Profitable Growth with Emphasis on Employee Development and Operational and Service Indices to Ensure that we are the Employer Of Choice and Supplier Of Choice"

QUALITY

Carsem's policy is to provide products and services of the highest quality through "ZERO DEFECTS TODAY!", preventive Quality culture. Employees will act with honesty, sincerity and operate as a team to continuously strive for improvements in quality, productivity, delivery, services and cost in order to be competitive and profitable. ZERO DEFECTS QUALITY is the responsibility of every employee.

PERSONAL DATA PROTECTION

The Hong Leong Group use personal data in accordance with the Hong Leong Group Privacy Notice for new applicants which can be found (http://www.hongleong.com.my).

Perks and benefits

• Medical Education support
• Dental Parking
• Medical for immediate family members
• car subsidy

What can I earn as an Industrial Engineer