Die Attach Process Development Senior Staff Engineer

Ams Osram; Bayan Lepas; On-site; MYR 50,000 - 70,000; Full time

Job summary

Ams Osram in Bayan Lepas, Penang is looking for a skilled engineer to develop and optimize FOL/EOL processes, especially the Die Attach process for new product development projects. The ideal candidate will have a degree in Electrical, Electronics, Mechatronics, or Mechanical Engineering, along with 2-3 years of experience in the semiconductor field.

The role includes responsibilities such as equipment selection, providing technical guidance to junior staff, and participating in engineering sample builds to fulfill customer orders. Join Ams Osram and become a part of a team that values innovation and high performance.

Qualifications

• 2-3 years in semiconductor field especially in Die Attach.
• Strong understanding of FOL/EOL processes.

Responsibilities

• Develop and optimize FOL/EOL processes for new product development.
• Equipment selection for project cost and quality targets.
• Provide technical guidance to junior staff.

Skills

Process engineering knowledge in semiconductors or LED manufacturing processes

Knowledge in process development step and statistic

B. Minitab knowledge

Six Sigma Green or Black Belt

Education

Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent

Job description

Overview

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Responsibilities

• Develop and optimize FOL/EOL processes; especially Die Attach process for new product development project to meet project cost, quality and timeline targets.
• Participate and support FOL/EOL processes technology roadmap and building block activities.
• Equipment selection which meet project cost, quality and timeline target.
• Share and transfer technical know how within R&D and to Manufacturing team.
• Provide technical guidance or job coaching to junior supporting staff.
• Participate in engineering sample, pre-series and ramp-up build to fulfill customer order.

Qualifications

• Degree or Master in Electrical / Electronics / Mechatronics / Mechanical Engineering or equivalent.
• 2-3 years in semiconductor field especially in Die Attach.
• Process egnineering knowledge in semiconductors or LED manufacturing processes.
• Knowledge in process development step and statistic.
• B. Minitab knowledge will be advantage.
• Six Sigma Green or Black Belt will be advantage.