Test Equipment Engineer: AI & Data-Driven Innovation

Winbond Electronics Corporation

Ipoh

On-site

MYR 66,960 - 100,440

Full time

14 days+

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Benefits offered by this job

绩效奖金
团体医疗保險
乐活假
新生子女补助6000元/月

Job summary

Winbond Electronics Corporation is hiring a Test Equipment Engineer (Ipoh, Malaysia) to support testing equipment development and maintenance for IC product verification. You will collaborate with R&D, manufacturing, and QA to ensure equipment reliability and data accuracy.

Qualifications include a university degree in engineering, 3+ years in test equipment roles, and English (intermediate) and Chinese (advanced) language proficiency.

Qualifications

  • University degree in engineering related field.
  • 3+ years of relevant work experience.
  • English intermediate and Chinese advanced; able to collaborate across departments.

Skills

English (Intermediate)
Chinese (Advanced)

Education

Bachelor's degree in Engineering

Job description

Winbond Electronics Corporation is hiring a Test Equipment Engineer (Ipoh, Malaysia) to support testing equipment development and maintenance for IC product verification. You will collaborate with R&D, manufacturing, and QA to ensure equipment reliability and data accuracy.

Qualifications include a university degree in engineering, 3+ years in test equipment roles, and English (intermediate) and Chinese (advanced) language proficiency.

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