Staff Product Development Engineer - 3D NAND Modules

SanDisk; Batu Kawan; On-site; MYR 180,000 - 300,000; Full time

Job summary

SanDisk is seeking a Staff Product Development Engineer (Module) in Penang, Malaysia. Work involves designing test plans for 3D NAND-based modulesystems, developing platforms, and ensuring hardware/software compatibility.

The role requires extensive experience in product engineering and failure analysis within semiconductor ICs. Applicants should have advanced degrees in E&E or Telecommunication and strong proficiency with ATE systems for module/system testing.

Qualifications

• PhD/MSc/MEng/Degree in E&E or Telecommunication.

Responsibilities

• Participates in designing a complete comprehensive framework of Functional Product Test Plan for module/system based on 3D NAND technology.
• Contributes to designing processes for technical platforms, system specifications, input/output and working parameters for hardware/software compatibility.
• Specialization in module/system test plans, process, test equipment's; proficiency in using module/system level ATE is a must.
• Conducts failure analysis on qualification failures and supports root-cause investigations.
• Influences future products by contributing to the architecture/framework used across multiple products.
• Designs, develops, and implements testing methods and troubleshooting procedures for NPIs in product development and manufacturing.
• Provides technical expertise for next generation initiatives and product characterization parameters.
• Plans labor, schedules, and equipment for testing standard and special devices.

Skills

HBM product development

Electronics knowledge

Education

PhD/MSc/MEng/Degree in E&E or Telecommunication

Tools

Module/system level ATE

Job description

SanDisk is seeking a Staff Product Development Engineer (Module) in Penang, Malaysia. Work involves designing test plans for 3D NAND-based modulesystems, developing platforms, and ensuring hardware/software compatibility.

The role requires extensive experience in product engineering and failure analysis within semiconductor ICs. Applicants should have advanced degrees in E&E or Telecommunication and strong proficiency with ATE systems for module/system testing.