Staff Process Engineer (semiconductor industry)

JAC Recruitment; Selangor; On-site; MYR 120,000 - 180,000; Full time

Job summary

JAC Recruitment is seeking a Staff Process Engineer for a leading semiconductor supplier in Malaysia, focusing on leading development, optimization, and transfer of packaging processes to ensure high-quality mass production.

You will drive PQFN packaging initiatives, support ramp-up, improve yield and costs, and collaborate with customers, suppliers and internal teams from development through NPI to mass production.

Qualifications

• Bachelor's Degree in Engineering, Physics, Materials Science, Chemistry, or a related field.
• Strong experience in semiconductor process engineering, package development, or advanced packaging technologies.
• Hands-on PQFN/Power QFN, Cu Clip, Thin Die, Wire Bonding, and SPS knowledge.
• Proven experience in Package Development, including qualification and process optimization activities.
• Experience managing projects from NPI through to Mass Production with strong problem-solving and stakeholder management skills.

Responsibilities

• Develop and qualify PQFN packaging processes for new products.
• Support production ramp-up and ensure manufacturing readiness.
• Improve yield, quality, capacity, and manufacturing costs.
• Work with customers, suppliers, and internal teams to resolve technical issues.
• Support product transfers from development/NPI stage to mass production.

Skills

PQFN/Power QFN

Cu Clip

Wire Bonding

SPS

Packaging development

Education

Bachelor's Degree in Engineering/related

Job description

Company Overview

One of the world's major semiconductor suppliers, especially in the automotive and industrial sectors. is seeking a Staff Process Engineer to join the team. This role involves leading the development, optimization, and transfer of semiconductor packaging processes to ensure high-quality and efficient mass production.

Job Responsibilities

• Develop and qualify Power QFN (PQFN) packaging processes for new products.
• Support production ramp-up and ensure manufacturing readiness.
• Improve yield, quality, capacity, and manufacturing costs.
• Work with customers, suppliers, and internal teams to resolve technical issues.
• Support product transfers from development/NPI stage to mass production

Job Requirements

• Bachelor's Degree in Engineering, Physics, Materials Science, Chemistry, or a related field.
• Strong experience in semiconductor process engineering, package development, or advanced packaging technologies.
• Hands-on experience and knowledge in PQFN/Power QFN, Cu Clip, Thin Die, Wire Bonding, and SPS (Smart Power Stage).
• Proven experience in Package Development, including qualification and process optimization activities.
• Experienced in managing projects from NPI (New Product Introduction) through to Mass Production, with strong problem-solving and stakeholder management skills.