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UST Malaysia is seeking an experienced engineer to perform system-level PI analysis and develop PDN models for package- and board-level power delivery networks. You will conduct DC, AC, and transient simulations using PowerSI, PowerDC, ADS, and HSPICE.
You will also perform SI analysis for high-speed interfaces across package, PCB and connector interconnects, using HFSS for model extraction and ADS for end-to-end channel analysis; familiarity with IBIS-AMI modeling, jitter analysis, and
Perform system-level power integrity (PI) analysis, including extraction and development of package- and board-level PDN models and construction of system-level power delivery networks; conduct DC, AC, and transient simulations using PowerSI, PowerDC, ADS, and HSPICE.
Perform signal integrity (SI) analysis for high-speed interfaces (e.g., DDR/LPDDR, PCIe, USB, SerDes, Ethernet) across package, PCB, and connector interconnects, using HFSS for model extraction and ADS for end-to-end channel analysis; working knowledge of IBIS-AMI modeling, jitter analysis, and equalization techniques (e.g., CTLE, DFE, FFE) preferred.
Review package and PCB layouts in Cadence Allegro.