Senior Thermal Design Engineer

Celestica

Bayan Lepas

On-site

MYR 120,000 - 240,000

Full time

3 days ago
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Job summary

Celestica in Penang, Malaysia, seeks an experienced Thermal Design Engineer to own thermal design for high-end electronics cooling solutions, from modeling to manufacturing transfer.

You will run thermal simulations, analyze test data, and collaborate with hardware, software, and thermal architects to deliver best-in-class products while balancing cost, manufacturability, and reliability.

Qualifications

  • Must have coursework in heat transfer and fluid mechanics.
  • 8 to 20 years of related experience in thermal design roles.
  • Experience with thermal modeling from concept to manufacturing transfer.

Responsibilities

  • Own thermal design for electronic products from modeling to testing and transfer to manufacturing.
  • Conduct thermal simulations, postprocessing, and analysis from chip to facility level.
  • Maintain awareness of heat transfer hardware, including costs and integration.
  • Plan and execute lab tests, build test stands, and document results.
  • Work with multi-disciplinary teams to define system requirements and identify root causes.

Skills

Thermal design
Thermal modeling
Heat transfer
Fluid mechanics
Thermal simulations
Data analysis
Statistical methods
Cross-functional collaboration

Education

Engineering coursework

Tools

Siemens Flotherm
Cadence Celsius

Job description

Join a world class team to create high end electronics cooling solutions for systems such as AI servers, switches, and accelerators. We work hard together to design at the leading edge of cooling technology. Must have relevant coursework in heat transfer and fluid mechanics, and good familiarity with Siemens Flotherm, Cadence Celsius applications.

As a member of the Hardware Product Development team, you have the ability to work in partnership with hardware, software, and thermal architects within and outside Celestica to define the best in class products. Celestica has a profoundly cooperative and nonconfrontational culture.

Responsibilities:
  • Complete ownership of thermal design for various electronic products from thermal modeling, design, test, and design revision, until transfer to manufacturing.
  • Conduct thermal simulations, postprocessing, and analysis ranging from chip to facilities level to verify thermal feasibility, risk, and to inform your designs.
  • Maintain awareness of heat transfer hardware available from all sources, including how it operates and performs, its cost, and how it can be incorporated into our products.
  • Conceive and implement ways to enhance and extend operation of heat transfer hardware.
  • Consider the thermal aspects of chip packaging technologies.
  • Apply best-in-class fluid flow geometry and technology to cool high heat flux chips.
  • Determine and consider the effects of contact resistance and the use of Thermal Interface Materials.
  • Apply air cooling when possible and liquid cooling when necessary to achieve full performance and reliability at the lowest cost.
  • Size liquid cold plates, heat sinks, heat pipes, air movers, air filters, air ducting, and perforated plates.
  • Plan your work to achieve full required performance, and stay on schedule to support overall product development.
  • Reference real world limitations to inform your work, such as manufacturing methods and cost, reliability, variability of incoming parts, and tolerances on all specifications.
  • Perform hands-on lab tests of equipment from component to rack and facility level for design and model validation. Document thermal test plans, devise and build test stands, including technical support, cooling liquid supply, power delivery, metrology and instrumentation, compute workload, experiment control, and data recording.
  • Analyze test data to draw inferences about the equipment tested. Apply statistical methods as required to maximize utilization of data and test usefulness.
  • Work with multi-disciplinary groups to define system requirements and design products.
  • Work with cross-functional teams to identify root causes of system performance.
Typical Experience:
  • 8 to 20 years of related experience in similar job roles
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