Senior Staff Engineer Equipment Engineering Die Bond/ SMT

Infineon Technologies AG; Malacca City; On-site; MYR 50,000 - 70,000; Full time

Job summary

Infineon Technologies AG in Malacca is seeking a Maintenance Engineer to drive planned maintenance and improve machine performance. The role includes leading maintenance teams, managing costs, and executing maintenance processes effectively.

The ideal candidate holds a Masters or Bachelor's in Engineering and has experience in Die Bond and SMT processes. A proactive attitude and a strong background in mechanical engineering are essential for success in this position.

Qualifications

• Masters/Bachelor’s in Engineering (Mechanical/Electrical/Electronics).
• Knowledge in Die Bond and SMT processes is a plus.
• Ability to build and lead high performance teams.

Responsibilities

• Drive planned maintenance definitions with high availability.
• Lead maintenance teams to execute scheduled maintenance.
• Manage maintenance cost for optimal equipment performance.

Skills

Team leadership

Process improvement

Knowledge in Die Bond and SMT processes

Mechanical engineering

Dynamic and proactive attitude

Education

Masters/Bachelor’s Degree in Engineering

Job description

To drive Die Bond/SMT planned maintenance systematic & methodology to ensure machine performance at the optimum condition. Execute equipment improvement and governance.

Key responsibilities

• Drive and build planned maintenance definition with high availability, good reliability and appropriate quality performance.
• Lead the planned maintenance teams and maintenance technician groups to execute equipment scheduled maintenance timely and comprehensively and define the parts life span and consumption
• Advanced Process Control Key numbers definition, pilot, implement, cascading at equipment platform
• Manage maintenance cost in sustaining the equipment to it fullest performance -Develop and execute EQ governance business process/framework.
• Drive a culture based of equipment improvement on maintenance routines and engineering solutions using training, systematic troubleshooting and root cause corrective actions.
• Executing Planned Maintenance according to BE MNT methodology (NICA,PMKits, OneSAP PM).

Qualifications

• Masters/Bachelor’s Degree in Engineering (Mechanical / Electrical/Electronics / Microelectronics / Mechatronics / Semiconductor Technology) or equivalent.
• Knowledge in Die Bond process, SMT process will be plus point.
• Ability to build a high performance team who can operate efficiently, effectively, productively and cost effectively.
• Be personally energetic, dynamic, proactive, committed, positive, enthusiastic and possess the ability to think laterally and act through reasoned decision making.
• Possess a broad background in mechanical engineering / manufacturing with a wide range of knowledge on manufacturing and production processes.
• Familiar with the latest equipment / technology in the industry and able to upgrade/ improve existing equipment to suit the business needs -Familiar with SMT equipment.

We embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.