Senior Process Innovator, Die Attach

Infineon Technologies AG; Malacca City; On-site; MYR 240,000 - 360,000; Full time

Job summary

Infineon Technologies AG is seeking a Principal Engineer for Unit Process Development Die Attach within the Research & Development team in Malaysia. You will shape future technology by leading process development, optimization, and cross-functional collaboration across supply chain and manufacturing.

The role requires a Master’s or Bachelor’s in Engineering and a minimum of 10 years in semiconductor manufacturing, with hands-on assembly experience, strong analytical skills, and IP-focused

Qualifications

• Master’s or Bachelor’s degree in Engineering or related field.
• Minimum 10 years in the semiconductor manufacturing industry.
• Hands-on knowledge of assembly processes and practices.
• Strong analytical and problem-solving skills.
• Knowledge of Design of Experiments (DOE).
• Proficient with MS Office applications.
• Excellent communication and presentation skills.
• Demonstrates trust, respect, and customer focus.
• Strives for excellence and supports talent development.

Responsibilities

• Perform process development activities, including parameter scouting and optimization.
• Manage technical handover and support prototype builds.
• Prepare process-related documentation and control plans.
• Collaborate with suppliers on tooling, equipment, and materials.
• Participate in problem-solving using SPC, APC, DOE, 8D, and FMEA.
• Identify, develop, and improve process technologies and capabilities.
• Support definition of process technologies, materials, equipment, and tooling.
• Provide technical guidance and mentorship to engineers.
• Initiate IP ideas through research and studies.

Education

Master’s or Bachelor’s in Engineering

Tools

MS Office

Job description

Infineon Technologies AG is seeking a Principal Engineer for Unit Process Development Die Attach within the Research & Development team in Malaysia. You will shape future technology by leading process development, optimization, and cross-functional collaboration across supply chain and manufacturing.

The role requires a Master’s or Bachelor’s in Engineering and a minimum of 10 years in semiconductor manufacturing, with hands-on assembly experience, strong analytical skills, and IP-focused