Principal Engineer — Die Attach Process Innovator

Infineon Technologies (Malaysia) Sdn Bhd; Malacca City; On-site; MYR 300,000 - 540,000; Full time

Job summary

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Principal Engineer Unit Process Development Die Attach to lead advanced process development in the die attach area. You will drive parameter scouting, optimization, verification, and process freeze while ensuring schedule, quality, cost competitiveness, and manufacturability.

You will mentor engineers, transfer knowledge, and contribute to process specifications, PFMEA/DFMEA, and tool qualifications.

Qualifications

• Master’s or Bachelor’s Degree in Engineering or a related discipline.
• Minimum 10 years of working experience in the semiconductor manufacturing industry.
• Hands-on knowledge of assembly processes and relevant industry practices.
• Strong analytical, problem-solving, collaboration, negotiation, and solution-finding skills.
• Knowledge of analytical equipment and statistical data analysis, including Design of Experiments (DOE).
• Proficient in Microsoft Office applications.
• Good communication and presentation skills.

Responsibilities

• Perform process development activities, including parameter scouting, optimization, verification, and process freeze.
• Manage technical handover, knowledge transfer, and support prototype and development sample builds.
• Prepare, maintain, and input process-related documentation (Process Specifications, PFMEA, DFMEA, OJTI, T32, PDR, etc.).
• Collaborate with suppliers on continuous improvement initiatives and verify new tooling, equipment, and materials.
• Participate in task forces and problem-solving using SPC, APC, DOE, 8D, and FMEA.
• Identify, develop, and improve process technologies and capabilities to meet requirements.
• Support definition of process technologies, materials, equipment, and tooling.
• Provide technical guidance and mentorship to engineers and project teams.
• Initiate and generate IP ideas through research and technical studies.

Skills

Process development

Project management

Mentorship

Analytical thinking

Communication

Education

Master’s degree in Engineering

Bachelor’s degree in Engineering

Tools

SPC

APC

DOE

8D

FMEA

Job description

Infineon Technologies (Malaysia) Sdn Bhd is seeking a Principal Engineer Unit Process Development Die Attach to lead advanced process development in the die attach area. You will drive parameter scouting, optimization, verification, and process freeze while ensuring schedule, quality, cost competitiveness, and manufacturability.

You will mentor engineers, transfer knowledge, and contribute to process specifications, PFMEA/DFMEA, and tool qualifications.