Senior PCB Design Engineer

Smart Modular Technologies Sdn Bhd; Permatang Pauh; On-site; MYR 70,000 - 100,000; Full time

Job summary

Smart Modular Technologies Sdn Bhd in Penang, Malaysia, seeks an experienced PCB layout engineer to design complex, high-density boards and optimize signal, power and thermal integrity for memory and storage products.

You will collaborate across hardware, mechanical and manufacturing teams, ensure DFM standards, and drive design verification and documentation through release packages.

Qualifications

• Master's Degree in Electrical and Electronics Engineering, Mechatronics.
• 5–8 years of experience in complex PCB design and layout.
• Experience with DDR4/DDR5, PCIe Gen4/Gen5/Gen6, SATA, USB or similar high-speed interfaces.
• Experience designing high-speed PCBs for memory and storage products.
• Strong understanding of high-speed PCB design, impedance control, and stack-up planning.
• Knowledge of PCB fabrication/assembly processes, IPC standards, and DFM/DFA principles.
• Proficient in Cadence Allegro/OrCAD, Allegro X software.
• Experience with PCB documentation, engineering change processes, and product release.
• Strong analytical and teamwork skills.

Responsibilities

• Design and develop advanced layouts for complex, high-density boards.
• Optimize placement and routing for signal, power, thermal, and EMI/EMC control.
• Develop designs for rigid and rigid-flex configurations.
• Collaborate with Hardware, Mechanical, SI/PI, and manufacturing teams to resolve issues.
• Ensure Design for Manufacturing standards with optimized stack-up.
• Prepare documentation for release packages including Gerber files.
• Lead design reviews, verification, and change activities.
• Drive continuous improvement of PCB design methodologies and best practices.

Skills

High-speed PCB design

Signal integrity

Power integrity

DFM / DFA

Documentation

Team collaboration

Project management

Education

Master's Degree in Electrical and Electronics Engineering, Mechatronics

Tools

Cadence Allegro/OrCAD

Allegro X software

Job description

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• Design and develop advanced layout for complex, high-density, and high-speed multi-layer boards (including HDI, blind/buried vias, skip vias and microvias).
• Optimize component placement and routing for signal integrity (SI), power integrity (PI), thermal performance, and EMI/EMC control.
• Develop high quality designs for various board types, including rigid and rigid-flex configurations.
• Work closely with Hardware, Mechanical, SI/PI, manufacturing and Project teams to interpret requirements, resolve design issues, and implement layout changes.
• Work with PCB fabrication to ensure Design for Manufacturing (DFM) standards are met, optimizing stack-up and maximizing manufacturing yield.
• Prepare and maintain comprehensive documentation for release packages, including, detailed assembly and fabrication drawings and Gerber files.
• Perform PCB layout planning, design reviews, design verification and design change activities.
• Drive continuous improvement initiatives to enhance PCB design methodologies, efficiency, design quality and best practices.

Qualifications

• Master's Degree in Electrical and Electronics Engineering, Mechatronics.
• Minimum 5–8 years of experience in complex PCB design and layout.
• Experience with DDR4/DDR5, PCIe Gen4/Gen5/Gen6, SATA, USB, or similar high-speed interfaces is highly desirable.
• Experience designing high-speed PCBs for memory and storage products is highly preferred.
• Strong understanding of high-speed PCB design, impedance control, stack-up planning, signal integrity and power integrity considerations.
• Strong knowledge of PCB fabrication and assembly processes, IPC standards, and DFM/DFA principles.
• Proficient in Cadence Allegro/OrCAD, Allegro X software.
• Experience with PCB documentation, engineering change processes, and product release.
• Strong analytical, problem-solving and teamwork skills.
• Good communication and interpersonal skills with the ability to collaborate effectively across cross-functional teams.
• Ability to manage multiple projects and priorities in a fast-paced R&D environment.