Engineer, Packaging Engineering

Sandisk; Simpang Ampat; On-site; MYR 90,000 - 150,000; Full time

Job summary

Sandisk in Penang, Malaysia seeks a packaging technology engineer to drive next generation memory packaging initiatives. You will integrate data pipelines, analyze process data, conduct experiments, and troubleshoot packaging issues to enable robust technology and efficient production.

The role requires a strong background in packaging development, data analysis, and collaboration with cross-functional teams to deliver AI-enabled solutions in a fast-paced manufacturing environment.

Qualifications

• Bachelor’s or Master’s degree in mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering discipline.
• Min 3 years relevant working experience in engineering field.

Responsibilities

• Drive product, process and materials technology roadmap solutions for next generation memory storage packaging.
• Integrate assembly/test data pipeline, analyze and transform process data.
• In-depth fundamental investigation/characterization in packaging development.
• Design and conduct experiments to troubleshoot process issues and validate improvements.
• Drive in-depth engineering investigations and problem-solving in delivering robust packaging technology.
• Collaborate with process, equipment, factory automation and IT teams to deliver automation and AI solutions.

Skills

JMP

Packaging development

Data analysis

Teamwork

Communication

Education

Bachelor’s or Master’s in engineering

Tools

JMP

Job description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Key technology development & tech-staging role to drive and enable product, process and materials technology roadmap solutions for next generation memory storage packaging solutions.
• Integrate assembly/test data pipeline, analyze and transform process data.
• In-depth fundamental investigation/characterization in packaging development.
• Design and conduct experiments to troubleshoot process issues and validate improvements.
• To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology.
• Collaborate closely with process, equipment, factory automation and IT teams to deliver robust and efficient automation, machine learning and AI solutions.

Qualifications

REQUIRED:

• Bachelor’s or master’s degree in mechanical, Electrical, Electronics, Microelectronics, Mechatronics, Materials Science, or related engineering discipline.
• Min 3 years relevant working experience, as engineering field.

Preferred

• Track record of AI/ML experience is added advantage.
• Demonstrated track record to pathfinding and development new SMT/FC/UF/Mold/TIM material with vendors and utilizing test methodology to qualify new material in factory.
• Demonstrated track record to rapidly analyze and solve complex engineering issues by pursuing a focused solution path with a clear understanding of technical fundamental on root causing thru failure analysis report (EDX/FTIR etc), simulation report, mechanical (shadow moire) analysis report, or any relevant metrology data collection.
• Strong attention to detail and commitment to achieving goals.
• Ability to adapt to changing priorities and work efficiently in a fast-paced environment.
• Strong experience in driving technology roadmap and technology innovation to achieve best-in-class advanced packaging technology & wafer level packaging solutions.

Skills

• Proficiency in statistical data analysis using JMP software.
• Strong hands‑on experience Packaging technology development experience and well‑versed with structured R&D methodology.
• Strong analytic skills and problem‑solving skills.
• Exposure to Industry 4.0 technologies, real‑time dashboards, or digital transformation initiatives in manufacturing.
• Passionate about technology and continuous improvement in a factory environment.
• Strong communication and teamwork skills.
• Self‑motivated, organized, and able to manage multiple tasks in a dynamic environment.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [e-mail] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.