NPI Process Engineer - Semiconductor Assembly & Packaging

Renesas

Teluk Panglima Garang

Presencial

MYR 90 000 - 150 000

Tempo integral

há 33 horas
Torna-te num dos primeiros candidatos

Recebe uma resposta deste empregador

O teu currículo e carta de apresentação, adaptados exatamente ao que estão a contratar.

Ultrapassa os filtros ATS

Resumo da oferta

Renesas Malaysia is seeking an experienced Process Engineer to develop, optimize, qualify, and transfer semiconductor assembly processes for Molding, IR Reflow, and Plating, ensuring quality, reliability, productivity, and cost targets.

You will collaborate with NPI, Production, Equipment Eng, QA, Product Eng, and Material Eng, to ensure successful product introductions and smooth mass production ramp.

Qualificações

  • Bachelor’s degree in engineering or related field required.
  • Minimum 5 years experience in semiconductor assembly, packaging, or manufacturing engineering is preferred (MOL processes).
  • Experience with power semiconductor or power discrete packaging is a plus.

Responsabilidades

  • Develop, establish, and optimize assembly process conditions for new products in Molding, Reflow & Plating.
  • Prepare and execute process development plans, engineering & qualification builds, and process validation activities.
  • Establish process parameters, specifications, control limits, and acceptance criteria.
  • Evaluate process feasibility, identify manufacturing risks, and implement preventive actions before mass production.
  • Review process capability, yield trends, defect data, and qualification results.
  • Prepare technical reports, process documentation, and qualification summaries.
  • Support safe launch activities and ensure critical issues are resolved before mass production release.

Conhecimentos

Analytical skills
Troubleshooting
Cross‑functional collaboration
Data analysis (Excel)

Formação académica

Bachelor’s Degree in Engineering (Materials, Chemical, Manufacturing)

Ferramentas

Towa molding machine
Plating machine
DOE
JMP analysis tools

Descrição da oferta de emprego

Renesas Malaysia is seeking an experienced Process Engineer to develop, optimize, qualify, and transfer semiconductor assembly processes for Molding, IR Reflow, and Plating, ensuring quality, reliability, productivity, and cost targets.

You will collaborate with NPI, Production, Equipment Eng, QA, Product Eng, and Material Eng, to ensure successful product introductions and smooth mass production ramp.

Obtém a tua avaliação gratuita e confidencial do currículo.

ou arrasta e larga o ficheiro aqui.

Similar jobs

Ofertas semelhantes que vale a pena comparar

NPI Semiconductor Assembly Engineer - Molding/Plating/Reflow
NPI Semiconductor Assembly Engineer - Molding/Plating/Reflow

Renesas Electronics (Malaysia) • Teluk Panglima Garang

Presencial
MYR 90 000 - 140 000
Senior NPI Process Engineer – Semiconductor Packaging
Senior NPI Process Engineer – Semiconductor Packaging

Renesas Electronics (Malaysia) • Teluk Panglima Garang

Presencial
MYR 90 000 - 150 000
Senior NPI Process Engineer - Semiconductor Packaging
Senior NPI Process Engineer - Semiconductor Packaging

Renesas Electronics Corp. • Selangor

Presencial
MYR 120 000 - 180 000
Competitive benefits package
NPI Semiconductor Front Assembly Engineer
NPI Semiconductor Front Assembly Engineer

Renesas Electronics (Malaysia) • Teluk Panglima Garang

Presencial
MYR 120 000 - 180 000
NPI Process Engineer: Semiconductor Assembly & Qualification
NPI Process Engineer: Semiconductor Assembly & Qualification

Renesas Electronics Corp. • Selangor

Presencial
MYR 120 000 - 180 000
Semiconductor Backend Assembly Process Engineer (NPI & Ramp)
Semiconductor Backend Assembly Process Engineer (NPI & Ramp)

Renesas Electronics (Malaysia) • Teluk Panglima Garang

Presencial
MYR 90 000 - 150 000
NPI Semiconductor Assembly Process Engineer
NPI Semiconductor Assembly Process Engineer

Renesas Electronics Corp. • Selangor

Presencial
MYR 90 000 - 150 000
Competitive benefits package
Global opportunities
NPI Assembly Process Lead: New Device Qualification
NPI Assembly Process Lead: New Device Qualification

Randstad – Renesas • Penang

Presencial
MYR 78 000 - 134 000
Staff Process Engineer - PQFN Packaging & NPI Scaling
Staff Process Engineer - PQFN Packaging & NPI Scaling

Renesas Electronics Corporation • Malásia

Presencial
MYR 60 000 - 100 000
NPI Assembly Engineer - Lead New Product Introductions
NPI Assembly Engineer - Lead New Product Introductions

Aitomic Jobs • Bayan Lepas

Presencial
MYR 120 000 - 200 000
Principais localizações