Senior Semiconductor Molding Engineer (Backend)

Nexperia; Seremban; On-site; MYR 90,000 - 150,000; Full time

Job summary

Nexperia in Malaysia is seeking a molding specialist to lead backend assembly molding processes. You will develop, characterize, optimize, and sustain molding operations, acting as technical owner for process performance, yield, and equipment stability in production.

You will collaborate with cross-functional teams across QA, R&D, NPI, and product design to drive improvements and ensure manufacturability. The role requires a Bachelor’s degree in Engineering, hands-on experience with molding

Qualifications

• This role requires a Bachelor’s degree in Engineering or a related technical discipline.
• Solid understanding of backend assembly molding processes, including compound flow, curing behavior, and defect mechanisms.
• Hands-on experience with molding tooling and Lauffer molding systems.
• Must have knowledge of molding compound properties, interactions, and material behavior.
• Familiarity with Six Sigma, DOE, SPC, FMEA, 8D and statistical analysis tools.

Responsibilities

• Develop, characterize, optimize, and sustain molding processes and equipment for semiconductor backend assembly.
• Act as technical owner for molding process performance, yield, and equipment stability in production.
• Provide technical leadership and guidance on molding-related topics within cross-functional project teams.
• Support new product introduction (NPI), process qualification, and ramp-up into HVM.
• Drive continuous improvement initiatives to enhance yield, quality, reliability, UPH, and cost efficiency.
• Identify molding process integration risks and define mitigation plans using structured engineering methods.
• Troubleshoot and resolve molding-related issues involving compound behavior, tooling, equipment, and system interactions.
• Collaborate closely with Process, Equipment, QA, R&D, NPI, Product Design, and Reliability teams.
• Maintain and update SOPs, process specifications, control plans, FMEAs, and technical reports.
• Contribute to technology and package roadmaps through benchmarking, studies, and data-driven recommendations.
• Provide technical support to internal stakeholders and external customers when required.
• Perform effectively in a fast-paced, high-volume manufacturing environment.

Skills

Backend molding processes

Compound flow and curing

Defect mechanisms

Molding tooling

Lauffer molding systems

Six Sigma, DOE, SPC, FMEA, 8D

Statistical analysis tools

Education

Bachelor’s degree in Engineering or related technical discipline

Tools

Molding equipment tooling

Lauffer molding systems

Job description

Nexperia in Malaysia is seeking a molding specialist to lead backend assembly molding processes. You will develop, characterize, optimize, and sustain molding operations, acting as technical owner for process performance, yield, and equipment stability in production.

You will collaborate with cross-functional teams across QA, R&D, NPI, and product design to drive improvements and ensure manufacturability. The role requires a Bachelor’s degree in Engineering, hands-on experience with molding