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Infineon Technologies (Malaysia) Sdn Bhd is seeking a Principal Engineer Unit Process Development Die Attach to lead advanced process development in the die attach area. You will drive parameter scouting, optimization, verification, and process freeze while ensuring schedule, quality, cost competitiveness, and manufacturability.
You will mentor engineers, transfer knowledge, and contribute to process specifications, PFMEA/DFMEA, and tool qualifications.
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Join the thinkers, builders, and problem-solvers behind tomorrow’s technology.
As a Principal Engineer Unit Process Development Die Attach in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.
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As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game‑changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.
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